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Title: Multiframe resolution-enhanced autostereoscopic system for on-machine 3-D surface metrology
Authors: Gao, S 
Li, D 
Cheung, CF 
Issue Date: 2024
Source: IEEE transactions on instrumentation and measurement, 2024, v. 73, 5037909
Abstract: This article presents a multiframe (MF) resolution-enhanced autostereoscopic system for the on-machine measurement of 3-D surfaces. It takes advantage of the vibration from the machine tool during the on-machine measurement process to acquire multiple frames of the target surface with offsets, thereby achieving resolution enhancement. A MF resolution-enhanced deep-learning model is developed to generate resolution-enhanced raw elemental images which significantly improve the measurement resolution of the system. The performance of the system is evaluated by experiments and the results show that the spatial resolution of the measurement data is enhanced four times with improved measurement accuracy.
Keywords: Autostereoscopy
Deep learning
Surface metrology
Publisher: Institute of Electrical and Electronics Engineers
Journal: IEEE transactions on instrumentation and measurement 
ISSN: 0018-9456
EISSN: 1557-9662
DOI: 10.1109/TIM.2024.3472890
Rights: © 2024 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
The following publication S. Gao, D. Li and C. Fai Cheung, "Multiframe Resolution-Enhanced Autostereoscopic System for On-Machine 3-D Surface Metrology," in IEEE Transactions on Instrumentation and Measurement, vol. 73, pp. 1-9, 2024, Art no. 5037909 is available at https://doi.org/10.1109/TIM.2024.3472890.
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