Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/118330
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dc.contributorDepartment of Electrical and Electronic Engineeringen_US
dc.creatorMeng, Hen_US
dc.creatorLiu, Jen_US
dc.creatorZhang, Yen_US
dc.creatorChung, CYen_US
dc.date.accessioned2026-04-02T06:09:43Z-
dc.date.available2026-04-02T06:09:43Z-
dc.identifier.issn0885-8993en_US
dc.identifier.urihttp://hdl.handle.net/10397/118330-
dc.language.isoenen_US
dc.publisherInstitute of Electrical and Electronics Engineersen_US
dc.rights© 2025 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en_US
dc.rightsThe following publication H. Meng, J. Liu, Y. Zhang and C. Y. Chung, 'An Online Gate Oxide Degradation Monitoring Method for SiC MOSFETs Based on Turn-ON Gate Current Change Rate,' in IEEE Transactions on Power Electronics, vol. 40, no. 9, pp. 12015-12020, Sept. 2025 is available at https://doi.org/10.1109/TPEL.2025.3571725.en_US
dc.subjectCondition monitoring (CM)en_US
dc.subjectGate currenten_US
dc.subjectGate oxideen_US
dc.subjectPCB Rogowski coilen_US
dc.subjectSiC metal-oxide-semiconductor field-effect transistor (MOSFET)en_US
dc.titleAn online gate oxide degradation monitoring method for SiC MOSFETs based on turn-on gate current change rateen_US
dc.typeJournal/Magazine Articleen_US
dc.identifier.spage12015en_US
dc.identifier.epage12020en_US
dc.identifier.volume40en_US
dc.identifier.issue9en_US
dc.identifier.doi10.1109/TPEL.2025.3571725en_US
dcterms.abstractGate oxide degradation (GOD) presents a reliability issue for silicon carbide metal-oxide-semiconductor field-effect transistors, especially under high-temperature and high-electric-field conditions. This letter proposes an online condition monitoring method based on the peak value of the turn-on gate current change rate (dig/dt,max). The technique utilizes a noninvasive PCB Rogowski coil to measure dig/dt,max, demonstrating high practicality. Accelerated aging tests under positive and negative high-temperature gate bias and high-temperature gate switching conditions reveal correlations between dig/dt,max and GOD, with variations of 5.61%, 5% and 8.33%, after 160 h of aging. Double pulse test (DPT) results indicate that dig/dt,max is independent of external factors, such as temperature, drain-source voltage (Vds), drain current (Ids) and package aging. Results from a buck converter further validate the feasibility of long-term online monitoring.en_US
dcterms.accessRightsopen accessen_US
dcterms.bibliographicCitationIEEE transactions on power electronics, Sept 2025, v. 40, no. 9, p. 12015-12020en_US
dcterms.isPartOfIEEE transactions on power electronicsen_US
dcterms.issued2025-09-
dc.identifier.scopus2-s2.0-105005801109-
dc.identifier.eissn1941-0107en_US
dc.description.validate202604 bcjzen_US
dc.description.oaAccepted Manuscripten_US
dc.identifier.SubFormIDG001367/2025-12-
dc.description.fundingSourceOthersen_US
dc.description.fundingTextThis work was supported by the Innovation and Technology Fund's Innovation and Technology Support Programme under Grant ITP/018/24AP.en_US
dc.description.pubStatusPublisheden_US
dc.description.oaCategoryGreen (AAM)en_US
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