Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/116544
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Title: Atomistic insights into the debonding of Epoxy-Concrete interface with water presence
Authors: Kai, MF 
Ji, WM
Dai, JG 
Issue Date: Aug-2022
Source: Engineering fracture mechanics, Aug. 2022, v. 271, 108668
Abstract: In this study, molecular models are developed to investigate the water-induced bond degradation of the epoxy–concrete interface. Concrete is simulated using the Csingle bondSsingle bondH binder. The results indicate that the interfacial chemical bonds, including Ca–O, Ca–N, and H-bond, are reduced due to the existence of water at the interface. Two different roles of water molecules are characterized in the interfacial structure, including the filling and enlarging roles. The water presence degrades the interfacial bond strength and accelerates the interface debonding process, attributed to the weakened interaction between the epoxy and the Csingle bondSsingle bondH and the weakened load transfer of water molecules. The fracture position is transferred from the internal epoxy to the interface between the epoxy and the Csingle bondSsingle bondH. These atomic-level findings facilitate a better understanding of the interfacial deterioration of epoxy-bonded systems, e.g., fiber-reinforced polymer (FRP)-strengthened concrete structures with water presence at the interface.
Keywords: Chemical bonding
C-S-H
Epoxy
Interfacial debonding
Water molecules
Publisher: Elsevier Ltd
Journal: Engineering fracture mechanics 
ISSN: 0013-7944
EISSN: 1873-7315
DOI: 10.1016/j.engfracmech.2022.108668
Rights: © 2022 Elsevier Ltd. All rights reserved.
© 2022. This manuscript version is made available under the CC-BY-NC-ND 4.0 license https://creativecommons.org/licenses/by-nc-nd/4.0/
The following publication Kai, M.-F., Ji, W.-M., & Dai, J.-G. (2022). Atomistic insights into the debonding of Epoxy–Concrete interface with water presence. Engineering Fracture Mechanics, 271, 108668 is available at https://doi.org/10.1016/j.engfracmech.2022.108668.
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