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| Title: | Reducing solidification cracks and enhancing mechanical performance in additively manufactured Cu-Ti alloys via chemical fluctuation manipulation | Authors: | Liu, Q Jin, S Ren, C Zhang, D Pu, Z Wen, H Ran, Y Dan, X Chen, X Ni, S Lu, J Chen, Z |
Issue Date: | 2025 | Source: | Virtual and physical prototyping, 2025, v. 20, no. 1, e2522274 | Abstract: | Additive manufacturing offers substantial design freedom for developing copper (Cu) alloy components with complex shapes. However, the extreme process conditions of this technique increase the risk of solidification cracking. Cu-titanium (Ti) alloy, a high-strength Cu alloy, exhibited solidification cracks due to the Ti segregation at grain boundaries when processed with laser powder bed fusion, reducing the appeal of Cu-Ti alloys in the additively manufactured Cu market. In this study, we incorporated chemical fluctuations via in-situ alloying in laser powder bed fusion to suppress solidification cracks. These fluctuations promote the transformation from coarse columnar grains to fine near-equiaxed grains, thereby mitigating solidification cracks at grain boundaries. Furthermore, we discovered that the degree of chemical inhomogeneity decreased with reducing the elemental powder size of in-situ alloying. Utilising this novel strategy, we successfully in-situ synthesised Cu-Ti alloys devoid of solidification cracks and strengthened by cellular microstructures. Compared to Cu-Ti alloys without chemical fluctuations fabricated using pre-alloyed powders, in-situ synthesised Cu-Ti alloys exhibited significantly boosted tensile strength (from 306.3 MPa to 534.7 MPa) and fracture elongation (from 1.8% to 18.4%). This study presents a practical methodology to address the challenge of solidification cracking in some additively manufactured Cu alloys. | Keywords: | Cellular microstructure Chemical fluctuation Copper alloy Laser powder bed fusion Solidification crack |
Publisher: | Taylor & Francis | Journal: | Virtual and physical prototyping | ISSN: | 1745-2759 | EISSN: | 1745-2767 | DOI: | 10.1080/17452759.2025.2522274 | Rights: | © 2025 The Author(s). Published by Informa UK Limited, trading as Taylor & Francis GroupThis is an Open Access article distributed under the terms of the Creative Commons Attribution-NonCommercial License (http://creativecommons.org/licenses/by-nc/4.0/), whichpermits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited. The terms on which this article has been pub-lished allow the posting of the Accepted Manuscript in a repository by the author(s) or with their consent. The following publication Liu, Q., Jin, S., Ren, C., Zhang, D., Pu, Z., Wen, H., … Chen, Z. (2025). Reducing solidification cracks and enhancing mechanical performance in additively manufactured Cu-Ti alloys via chemical fluctuation manipulation. Virtual and Physical Prototyping, 20(1) is available at https://doi.org/10.1080/17452759.2025.2522274. |
| Appears in Collections: | Journal/Magazine Article |
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| File | Description | Size | Format | |
|---|---|---|---|---|
| Liu_Reducing_Solidification_Cracks.pdf | 4.45 MB | Adobe PDF | View/Open |
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