Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/114065
| DC Field | Value | Language |
|---|---|---|
| dc.contributor | Department of Industrial and Systems Engineering | - |
| dc.creator | Liu, Q | - |
| dc.creator | Jin, S | - |
| dc.creator | Ren, C | - |
| dc.creator | Zhang, D | - |
| dc.creator | Pu, Z | - |
| dc.creator | Wen, H | - |
| dc.creator | Ran, Y | - |
| dc.creator | Dan, X | - |
| dc.creator | Chen, X | - |
| dc.creator | Ni, S | - |
| dc.creator | Lu, J | - |
| dc.creator | Chen, Z | - |
| dc.date.accessioned | 2025-07-10T06:21:53Z | - |
| dc.date.available | 2025-07-10T06:21:53Z | - |
| dc.identifier.issn | 1745-2759 | - |
| dc.identifier.uri | http://hdl.handle.net/10397/114065 | - |
| dc.language.iso | en | en_US |
| dc.publisher | Taylor & Francis | en_US |
| dc.rights | © 2025 The Author(s). Published by Informa UK Limited, trading as Taylor & Francis GroupThis is an Open Access article distributed under the terms of the Creative Commons Attribution-NonCommercial License (http://creativecommons.org/licenses/by-nc/4.0/), whichpermits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited. The terms on which this article has been pub-lished allow the posting of the Accepted Manuscript in a repository by the author(s) or with their consent. | en_US |
| dc.rights | The following publication Liu, Q., Jin, S., Ren, C., Zhang, D., Pu, Z., Wen, H., … Chen, Z. (2025). Reducing solidification cracks and enhancing mechanical performance in additively manufactured Cu-Ti alloys via chemical fluctuation manipulation. Virtual and Physical Prototyping, 20(1) is available at https://doi.org/10.1080/17452759.2025.2522274. | en_US |
| dc.subject | Cellular microstructure | en_US |
| dc.subject | Chemical fluctuation | en_US |
| dc.subject | Copper alloy | en_US |
| dc.subject | Laser powder bed fusion | en_US |
| dc.subject | Solidification crack | en_US |
| dc.title | Reducing solidification cracks and enhancing mechanical performance in additively manufactured Cu-Ti alloys via chemical fluctuation manipulation | en_US |
| dc.type | Journal/Magazine Article | en_US |
| dc.identifier.volume | 20 | - |
| dc.identifier.issue | 1 | - |
| dc.identifier.doi | 10.1080/17452759.2025.2522274 | - |
| dcterms.abstract | Additive manufacturing offers substantial design freedom for developing copper (Cu) alloy components with complex shapes. However, the extreme process conditions of this technique increase the risk of solidification cracking. Cu-titanium (Ti) alloy, a high-strength Cu alloy, exhibited solidification cracks due to the Ti segregation at grain boundaries when processed with laser powder bed fusion, reducing the appeal of Cu-Ti alloys in the additively manufactured Cu market. In this study, we incorporated chemical fluctuations via in-situ alloying in laser powder bed fusion to suppress solidification cracks. These fluctuations promote the transformation from coarse columnar grains to fine near-equiaxed grains, thereby mitigating solidification cracks at grain boundaries. Furthermore, we discovered that the degree of chemical inhomogeneity decreased with reducing the elemental powder size of in-situ alloying. Utilising this novel strategy, we successfully in-situ synthesised Cu-Ti alloys devoid of solidification cracks and strengthened by cellular microstructures. Compared to Cu-Ti alloys without chemical fluctuations fabricated using pre-alloyed powders, in-situ synthesised Cu-Ti alloys exhibited significantly boosted tensile strength (from 306.3 MPa to 534.7 MPa) and fracture elongation (from 1.8% to 18.4%). This study presents a practical methodology to address the challenge of solidification cracking in some additively manufactured Cu alloys. | - |
| dcterms.accessRights | open access | en_US |
| dcterms.bibliographicCitation | Virtual and physical prototyping, 2025, v. 20, no. 1, e2522274 | - |
| dcterms.isPartOf | Virtual and physical prototyping | - |
| dcterms.issued | 2025 | - |
| dc.identifier.scopus | 2-s2.0-105008931404 | - |
| dc.identifier.eissn | 1745-2767 | - |
| dc.identifier.artn | e2522274 | - |
| dc.description.validate | 202507 bcch | - |
| dc.description.oa | Version of Record | en_US |
| dc.identifier.FolderNumber | a3837 | en_US |
| dc.identifier.SubFormID | 51301 | en_US |
| dc.description.fundingSource | RGC | en_US |
| dc.description.fundingSource | Others | en_US |
| dc.description.fundingText | Shenzhen Municipal Science and Technology Innovation Commission | en_US |
| dc.description.pubStatus | Published | en_US |
| dc.description.oaCategory | CC | en_US |
| Appears in Collections: | Journal/Magazine Article | |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Liu_Reducing_Solidification_Cracks.pdf | 4.45 MB | Adobe PDF | View/Open |
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