Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/114065
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dc.contributorDepartment of Industrial and Systems Engineering-
dc.creatorLiu, Q-
dc.creatorJin, S-
dc.creatorRen, C-
dc.creatorZhang, D-
dc.creatorPu, Z-
dc.creatorWen, H-
dc.creatorRan, Y-
dc.creatorDan, X-
dc.creatorChen, X-
dc.creatorNi, S-
dc.creatorLu, J-
dc.creatorChen, Z-
dc.date.accessioned2025-07-10T06:21:53Z-
dc.date.available2025-07-10T06:21:53Z-
dc.identifier.issn1745-2759-
dc.identifier.urihttp://hdl.handle.net/10397/114065-
dc.language.isoenen_US
dc.publisherTaylor & Francisen_US
dc.rights© 2025 The Author(s). Published by Informa UK Limited, trading as Taylor & Francis GroupThis is an Open Access article distributed under the terms of the Creative Commons Attribution-NonCommercial License (http://creativecommons.org/licenses/by-nc/4.0/), whichpermits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited. The terms on which this article has been pub-lished allow the posting of the Accepted Manuscript in a repository by the author(s) or with their consent.en_US
dc.rightsThe following publication Liu, Q., Jin, S., Ren, C., Zhang, D., Pu, Z., Wen, H., … Chen, Z. (2025). Reducing solidification cracks and enhancing mechanical performance in additively manufactured Cu-Ti alloys via chemical fluctuation manipulation. Virtual and Physical Prototyping, 20(1) is available at https://doi.org/10.1080/17452759.2025.2522274.en_US
dc.subjectCellular microstructureen_US
dc.subjectChemical fluctuationen_US
dc.subjectCopper alloyen_US
dc.subjectLaser powder bed fusionen_US
dc.subjectSolidification cracken_US
dc.titleReducing solidification cracks and enhancing mechanical performance in additively manufactured Cu-Ti alloys via chemical fluctuation manipulationen_US
dc.typeJournal/Magazine Articleen_US
dc.identifier.volume20-
dc.identifier.issue1-
dc.identifier.doi10.1080/17452759.2025.2522274-
dcterms.abstractAdditive manufacturing offers substantial design freedom for developing copper (Cu) alloy components with complex shapes. However, the extreme process conditions of this technique increase the risk of solidification cracking. Cu-titanium (Ti) alloy, a high-strength Cu alloy, exhibited solidification cracks due to the Ti segregation at grain boundaries when processed with laser powder bed fusion, reducing the appeal of Cu-Ti alloys in the additively manufactured Cu market. In this study, we incorporated chemical fluctuations via in-situ alloying in laser powder bed fusion to suppress solidification cracks. These fluctuations promote the transformation from coarse columnar grains to fine near-equiaxed grains, thereby mitigating solidification cracks at grain boundaries. Furthermore, we discovered that the degree of chemical inhomogeneity decreased with reducing the elemental powder size of in-situ alloying. Utilising this novel strategy, we successfully in-situ synthesised Cu-Ti alloys devoid of solidification cracks and strengthened by cellular microstructures. Compared to Cu-Ti alloys without chemical fluctuations fabricated using pre-alloyed powders, in-situ synthesised Cu-Ti alloys exhibited significantly boosted tensile strength (from 306.3 MPa to 534.7 MPa) and fracture elongation (from 1.8% to 18.4%). This study presents a practical methodology to address the challenge of solidification cracking in some additively manufactured Cu alloys.-
dcterms.accessRightsopen accessen_US
dcterms.bibliographicCitationVirtual and physical prototyping, 2025, v. 20, no. 1, e2522274-
dcterms.isPartOfVirtual and physical prototyping-
dcterms.issued2025-
dc.identifier.scopus2-s2.0-105008931404-
dc.identifier.eissn1745-2767-
dc.identifier.artne2522274-
dc.description.validate202507 bcch-
dc.description.oaVersion of Recorden_US
dc.identifier.FolderNumbera3837en_US
dc.identifier.SubFormID51301en_US
dc.description.fundingSourceRGCen_US
dc.description.fundingSourceOthersen_US
dc.description.fundingTextShenzhen Municipal Science and Technology Innovation Commissionen_US
dc.description.pubStatusPublisheden_US
dc.description.oaCategoryCCen_US
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