Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/113803
| DC Field | Value | Language |
|---|---|---|
| dc.contributor | Department of Mechanical Engineering | - |
| dc.creator | Gong, G | en_US |
| dc.creator | Hu, F | en_US |
| dc.creator | Wang, F | en_US |
| dc.creator | Muddassir, M | en_US |
| dc.creator | Zhou, P | en_US |
| dc.creator | Li, L | en_US |
| dc.creator | Wang, Q | en_US |
| dc.creator | He, Z | en_US |
| dc.creator | NavarroAlarcon, D | en_US |
| dc.date.accessioned | 2025-06-24T06:38:02Z | - |
| dc.date.available | 2025-06-24T06:38:02Z | - |
| dc.identifier.issn | 0018-9456 | en_US |
| dc.identifier.uri | http://hdl.handle.net/10397/113803 | - |
| dc.language.iso | en | en_US |
| dc.publisher | Institute of Electrical and Electronics Engineers | en_US |
| dc.rights | © 2025 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. | en_US |
| dc.rights | The following publication G. Gong et al., "TEVIO: Thermal-Aided Event-Based Visual–Inertial Odometry for Robust State Estimation in Challenging Environments," in IEEE Transactions on Instrumentation and Measurement, vol. 74, pp. 1-11, 2025, Art no. 7505211 is available at https://doi.org/10.1109/TIM.2025.3552392. | en_US |
| dc.subject | Dynamic vision sensor | en_US |
| dc.subject | Multimodal fusion | en_US |
| dc.subject | Thermal sensor | en_US |
| dc.subject | Visual-inertial odometry | en_US |
| dc.title | TEVIO : thermal-aided event-based visual–inertial odometry for robust state estimation in challenging environments | en_US |
| dc.type | Journal/Magazine Article | en_US |
| dc.description.otherinformation | Title on author's file: TEVIO: Thermal-Aided Event-based Visual Inertial Odometry for Robust State Estimation in Challenging Environments | en_US |
| dc.identifier.volume | 74 | en_US |
| dc.identifier.doi | 10.1109/TIM.2025.3552392 | en_US |
| dcterms.abstract | Event-based visual odometry (VO) excels in high-dynamic-range scenarios but struggles in extremely low-light or low-contrast conditions, motivating the integration of thermal imaging. This article presents thermal-aided event-based visual-inertial odometry (TEVIO), a multimodal system that fuses thermal imaging, event-based vision, and inertial measurements to address the challenges of visual-inertial odometry in low-light, high-dynamic-range, and low-texture environments. An enhanced time surface map (ETSM) improves feature extraction for high-motion and low-texture scenes. A parallel frequency-varied tracking framework then estimates the pose stably and in high precision. Extensive tests on public event camera datasets and real-world outdoor vehicle experiments show TEVIO’s superior tracking accuracy and robustness compared to state-of-the-art monocular methods like EVIO, enabling reliable pose estimation in conditions where conventional approaches fail. A video demonstration is available at https://youtu.be/RfWYU15WwsU. | - |
| dcterms.accessRights | open access | en_US |
| dcterms.bibliographicCitation | IEEE transactions on instrumentation and measurement, 2025, v. 74, 7505211 | en_US |
| dcterms.isPartOf | IEEE transactions on instrumentation and measurement | en_US |
| dcterms.issued | 2025 | - |
| dc.identifier.scopus | 2-s2.0-105002303663 | - |
| dc.identifier.eissn | 1557-9662 | en_US |
| dc.identifier.artn | 7505211 | en_US |
| dc.description.validate | 202506 bcch | - |
| dc.description.oa | Accepted Manuscript | en_US |
| dc.identifier.FolderNumber | a3769b | - |
| dc.identifier.SubFormID | 51009 | - |
| dc.description.fundingSource | RGC | en_US |
| dc.description.pubStatus | Published | en_US |
| dc.description.oaCategory | Green (AAM) | en_US |
| Appears in Collections: | Journal/Magazine Article | |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Gong_TEVIO_Thermal_Aided.pdf | Pre-Published version | 1.2 MB | Adobe PDF | View/Open |
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