Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/107382
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dc.contributorDepartment of Mechanical Engineeringen_US
dc.contributorResearch Institute for Advanced Manufacturingen_US
dc.creatorFeng, ZYen_US
dc.creatorLi, Hen_US
dc.creatorZhang, Den_US
dc.creatorFu, MWen_US
dc.date.accessioned2024-06-18T09:02:21Z-
dc.date.available2024-06-18T09:02:21Z-
dc.identifier.isbn978-3-031-41340-7en_US
dc.identifier.isbn978-3-031-41341-4 (eBook)en_US
dc.identifier.urihttp://hdl.handle.net/10397/107382-
dc.description14th International Conference on the Technology of Plasticity, Congress Center, Mandelieu, La Napoule, Bay of Cannes, France, September 24-29, 2023en_US
dc.language.isoenen_US
dc.publisherSpringeren_US
dc.rights© The Author(s), under exclusive license to Springer Nature Switzerland AG 2024en_US
dc.rightsThis version of the proceeding paper has been accepted for publication, after peer review (when applicable) and is subject to Springer Nature’s AM terms of use(https://www.springernature.com/gp/open-research/policies/accepted-manuscript-terms), but is not the Version of Record and does not reflect post-acceptance improvements, or any corrections. The Version of Record is available online at: http://dx.doi.org/10.1007/978-3-031-41341-4_42.en_US
dc.subjectCrystal plasticityen_US
dc.subjectMicroformingen_US
dc.subjectSize effecten_US
dc.subjectStatistical distributionen_US
dc.subjectStress/strain frequencyen_US
dc.titleSize effect on the statistical distribution of stress and strain in microformingen_US
dc.typeConference Paperen_US
dc.identifier.spage413en_US
dc.identifier.epage421en_US
dc.identifier.doi10.1007/978-3-031-41341-4_42en_US
dcterms.abstractThe frequency distribution of local stress or strain across the micromechanical field in plastic deformation tends to universally follow a normal or lognormal distribution, regardless of the variety of microstructural inhomogeneity. However, it has not been reported how size effect (SE) influences the grain-scale statistical distribution of stress and strain in microforming, and thus an in-depth investigation is further needed. Taking the polycrystalline Cu sheets with thickness t = 0.1–1.5 mm and t/d = 1–29 as the case materials, this study implements the full-field CPFE simulation incorporated with a size-dependent dislocation-based constitutive model and statistical analyses to explore the influence of SE on the frequency distribution of grain-scale stress and strain in micro-scaled plastic deformation. With increasing t/d, the stress frequency consistently follows a normal distribution. In contrast, the frequency distributions of strain and dislocation density undergo a transformation from a lognormal distribution to an approximately normal distribution. The results indicate that the distribution law of stress is dominantly influenced by the dislocation density, while that of strain is determined by a multiplicative process of slip activities. The established knowledge will help to elucidate the nature of the distribution law of stress or strain, and to seek for effective approaches to alleviate the scatter and uncertainty of deformed part geometry during a microforming process.en_US
dcterms.accessRightsopen accessen_US
dcterms.bibliographicCitationIn Mocellin, K, Bouchard, PO, Bigot, R, & Balan, T (Eds), Proceedings of the 14th International Conference on the Technology of Plasticity : Current Trends in the Technology of Plasticity : ICTP 2023 - Volume 3, p. 413-421. Cham, Switzerland: Springer, 2024.en_US
dcterms.issued2023-
dc.identifier.scopus2-s2.0-85174844079-
dc.relation.conferenceInternational Conference on the Technology of Plasticity [ICTP]en_US
dc.description.validate202406 bcchen_US
dc.description.oaAccepted Manuscripten_US
dc.identifier.FolderNumbera2828b-
dc.identifier.SubFormID48530-
dc.description.fundingSourceRGCen_US
dc.description.fundingSourceOthersen_US
dc.description.fundingTextHong Kong Polytechnic University; National Natural Science Foundation of Chinaen_US
dc.description.pubStatusPublisheden_US
dc.description.oaCategoryGreen (AAM)en_US
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