Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/106315
Title: | Effect of stress-dependent thermal conductivity on thermo-mechanical coupling behavior in GaN-based nanofilm under pulse heat source | Authors: | Li, Q Tang, X Zhu, L Ruan, H |
Issue Date: | Feb-2021 | Source: | Acta mechanica solida sinica, Feb. 2021, v. 34, no. 1, p. 27-39 | Abstract: | The thermal properties of a nanostructured semiconductor are affected by multi-physical fields, such as stress and electromagnetic fields, causing changes in temperature and strain distributions. In this work, the influence of stress-dependent thermal conductivity on the heat transfer behavior of a GaN-based nanofilm is investigated. The finite element method is adopted to simulate the temperature distribution in a prestressed nanofilm under heat pulses. Numerical results demonstrate the effect of stress field on the thermal conductivity of GaN-based nanofilm, namely, the prestress and the thermal stress lead to a change in the heat transfer behavior in the nanofilm. Under the same heat source, the peak temperature of the film with stress-dependent thermal conductivity is significantly lower than that of the film with a constant thermal conductivity and the maximum temperature difference can reach 8.2 K. These results could be useful for designing GaN-based semiconductor devices with higher reliability under multi-physical fields. | Keywords: | Finite element method GaN-based nanofilm Heat transfer behavior Multi-physical effect Prestress fields Stress-dependent thermal conductivity |
Publisher: | Springer | Journal: | Acta mechanica solida sinica | ISSN: | 0894-9166 | EISSN: | 1860-2134 | DOI: | 10.1007/s10338-020-00182-z | Rights: | © The Chinese Society of Theoretical and Applied Mechanics 2020 This version of the article has been accepted for publication, after peer review (when applicable) and is subject to Springer Nature’s AM terms of use(https://www.springernature.com/gp/open-research/policies/accepted-manuscript-terms), but is not the Version of Record and does not reflect post-acceptance improvements, or any corrections. The Version of Record is available online at: https://doi.org/10.1007/s10338-020-00182-z. |
Appears in Collections: | Journal/Magazine Article |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
Ruan_Effect_Stress-Dependent_Thermal.pdf | Pre-Published version | 1.64 MB | Adobe PDF | View/Open |
Page views
10
Citations as of Jun 30, 2024
Downloads
2
Citations as of Jun 30, 2024
SCOPUSTM
Citations
2
Citations as of Jul 4, 2024
WEB OF SCIENCETM
Citations
1
Citations as of Jul 4, 2024
![](/image/google_scholar.jpg)
Google ScholarTM
Check
Altmetric
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.