Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/105581
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Title: Study TOUR for computer science students
Authors: Chan, HCB 
Leong, HV 
Ngai, G 
Issue Date: 2019
Source: 2019 IEEE 43rd Annual Computer Software and Applications Conference (COMPSAC), 15-19 July 2019, Milwaukee, Wisconsin, v. 1, p. 242-251
Abstract: This paper presents a general framework of an innovative TOUR model with four interrelated elements: Transformation, Outreach, Unification and Reinforcement, enhancing the learning experiences of computer science/computing students via a study tour. We brought our students on an overseas trip as an integral part of an academic course. The immediate goal of the study tour was to gear the students toward the program learning outcomes. Another goal was to take a first step in supporting the TOUR model, to immerse students within these four interrelated important learning and self-improvement elements, and to support each student in becoming a better person. The study tour comprises six core learning activities aligned with the TOUR elements. Evaluations were conducted based on a student survey and self-reflection. The results provide valuable insights into the design of the computer science student study tour, as well as the potential value of the TOUR model.
Keywords: Experiential learning
Self improvement
Study tour
Publisher: Institute of Electrical and Electronics Engineers
ISBN: 978-1-7281-2607-4
DOI: 10.1109/COMPSAC.2019.00043
Rights: © 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
The following publication H. C. B. Chan, H. V. Leong and G. Ngai, "Study TOUR for Computer Science Students," 2019 IEEE 43rd Annual Computer Software and Applications Conference (COMPSAC), Milwaukee, WI, USA, 2019, pp. 242-251 is available at https://doi.org/10.1109/COMPSAC.2019.00043.
Appears in Collections:Conference Paper

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