Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/104209
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Title: Tuning deformation behavior of Cu₀.₅CoNiCrAl high-entropy alloy via cooling rate gradient : an atomistic study
Authors: Feng, S 
Li, L
Chan, KC 
Zhao, L 
Pan, S
Wang, L
Liu, R
Issue Date: Sep-2019
Source: Intermetallics, Sept 2019, v. 112, 106553
Abstract: The deformation behaviors of body-centered cubic Cu0.5CoNiCrAl high-entropy alloys processed by the cooling rate gradient are investigated by the molecular dynamics simulations. The plastic deformation ability of the high-entropy alloy is significantly improved by triggering multiple-type dislocation slips along different deformation paths. The cooling rate gradient introduces abundant atomic vacancies, proliferating the nucleation sites of dislocations. Additionally, the nucleation barriers of dislocations are reduced by the resultant structural disorder, high potential energy and chemical segregation. Consequently, the cooling rate gradient enhances the structural heterogeneity, promoting the formation of multiple deformation paths and preventing strain localization.
Keywords: High–entropy alloys
Dislocation structure
Grain boundary
Microstructure
Plastic deformation unit
Molecular dynamic simulation
Publisher: Elsevier Ltd
Journal: Intermetallics 
ISSN: 0966-9795
EISSN: 1879-0216
DOI: 10.1016/j.intermet.2019.106553
Rights: © 2019 Published by Elsevier Ltd.
© 2019. This manuscript version is made available under the CC-BY-NC-ND 4.0 license https://creativecommons.org/licenses/by-nc-nd/4.0/
The following publication Feng, S., Li, L., Chan, K. C., Zhao, L., Pan, S., Wang, L., & Liu, R. (2019). Tuning deformation behavior of Cu0.5CoNiCrAl high-entropy alloy via cooling rate gradient: An atomistic study. Intermetallics, 112, 106553 is available at https://doi.org/10.1016/j.intermet.2019.106553.
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