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Title: Conventional sintered Cu2-xSe thermoelectric material
Authors: Geng, ZM 
Shi, DL 
Shi, L 
Li, Y 
Snyder, GJ
Lam, KH 
Issue Date: 2019
Source: Journal of materiomics, Dec. 2019, v. 5, no. 4, p. 626-633
Abstract: As the featured material of the superionic thermoelectric (TE) material family, copper-chalcogenide Cu2-xSe is attracting growing research interest for its excellent TE performance derived from the satisfactory power factor and the ultra-low thermal conductivity induced by the superionic effect. Various efforts have been made and proved to be effective to further enhance the TE performance for Cu2-xSe. However, this material is still far from the application stage, which is mainly due to concerns regarding control of the properties and the costly complex fabrication technology. Here we report a scalable pathway to achieve high-performance and tunable Cu2-xSe, utilizing conventional sintering technology and copper (Cu)-vacancy engineering with an effective mass model. The figure of merit zT is a competitive value of 1.0 at 800 K for the optimized binary Cu2-xSe, based on the precise modeling prediction and Cu-vacancy engineering. The changes in TE properties of Cu2-xSe under heating-cooling cycle tests are also revealed. Our work offers the referable method along with the decent parent material for further enhancement of TE performance, paving a possible route for the application and industrialization of Cu2-xSe TE materials.
Keywords: Thermoelectric
Copper selenide
Copper-vacancy engineering
Effective mass model
Publisher: Elsevier
Journal: Journal of materiomics 
ISSN: 2352-8478
DOI: 10.1016/j.jmat.2019.06.005
Rights: ©2019 The Chinese Ceramic Society. Production and hosting by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0).
The following publication Geng, Z. M., Shi, D. L., Shi, L., Li, Y., Snyder, G. J., & Lam, K. H. (2019). Conventional sintered Cu2-xSe thermoelectric material. Journal of Materiomics, 5(4), 626-633 is available at https://dx.doi.org/10.1016/j.jmat.2019.06.005
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