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Title: Dynamics of an ultrasonic transducer used for wire bonding
Authors: Or, DSW 
Chan, HLW 
Lo, VC
Yuen, CW
Keywords: Bonding
Piezoelectric transducers
Wire bonding
Ultrasonic transducers
Issue Date: Nov-1998
Publisher: Institute of Electrical and Electronics Engineers
Source: IEEE transactions on ultrasonics, ferroelectrics, and frequency control, Nov. 1998, v. 45, no. 6, p. 1453-1460 How to cite?
Journal: IEEE transactions on ultrasonics, ferroelectrics, and frequency control 
Abstract: The vibration displacement distributions along a transducer used in ultrasonic wire bonding were measured using a heterodyne interferometer, and many nodes and anti-nodes were found. A mechanical finite element method (FEM) was used to compute the resonant frequencies and vibration mode shapes. The displacement distributions of the dominant 2nd axial mode agreed well with the measured values. Undesirable nonaxial modes, including the higher order flexural and torsional modes, also were excited at frequencies very close to the working frequency (2nd axial mode) of the transducer. Hence, the measured displacements were the resultant of all the allowable modes being excited. However, the excitation of these nonaxial modes were small enough not to affect the formation of consistent and high quality wire bonds. Results of the present study were used to determine a suitable location for installing a piezoelectric sensor to monitor the bond quality.
ISSN: 0885-3010
EISSN: 1525-8955
DOI: 10.1109/58.738285
Rights: © 1998 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
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