Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/2483
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Title: Interfacial defects in resistive switching devices probed by thermal analysis
Authors: Lau, HK
Leung, DCW 
Hu, W
Chan, PKL
Issue Date: 1-Jul-2009
Source: Journal of applied physics, 1 July 2009, v. 106, no. 1, 014504, p. 1-4
Abstract: Resistive switching mechanism is investigated by thermal analysis of metal electrodes in the planar Al/Pr₀.₇Ca₀.₃MnO₃(PCMO)/Ni resistive switching device geometry. Two microthermocouples are used to monitor the electrode temperatures under different electrical bias conditions. Comparison of temperature differences between Al and Ni electrodes at high and low resistance states suggests that local heat source exists under the Al electrode at high resistance state. It agrees well with the recent finding in which AlO᙮ presents at the Al/PCMO interface and it can be the origin of the resistance switching mechanism [Li et al., J. Phys. D 42, 045411 (2009)]. Thermal measurements demonstrate excellent capability on characterizing resistance switching devices.
Keywords: Aluminium
Calcium compounds
Electrodes
Interface structure
Nickel
Praseodymium compounds
Switches
Thermal analysis
Publisher: American Institute of Physics
Journal: Journal of applied physics 
ISSN: 0021-8979
EISSN: 1089-7550
DOI: 10.1063/1.3157207
Rights: © 2009 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The following article appeared in H.K. Lau al., J. Appl. Phys. 106, 014504 (2009) and may be found at http://link.aip.org/link/?jap/106/014504
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