Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/99253
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dc.contributorDepartment of Mechanical Engineeringen_US
dc.creatorWang, Zen_US
dc.creatorZhang, Sen_US
dc.creatorLi, Yen_US
dc.creatorWang, Qen_US
dc.creatorSu, Zen_US
dc.creatorYue, Den_US
dc.date.accessioned2023-07-04T08:29:50Z-
dc.date.available2023-07-04T08:29:50Z-
dc.identifier.issn0018-9456en_US
dc.identifier.urihttp://hdl.handle.net/10397/99253-
dc.language.isoenen_US
dc.publisherInstitute of Electrical and Electronics Engineersen_US
dc.rights© 2022 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en_US
dc.rightsThe following publication Wang, Z., Zhang, S., Li, Y., Wang, Q., Su, Z., & Yue, D. (2022). A cross-scanning crack damage quantitative monitoring and imaging method. IEEE Transactions on Instrumentation and Measurement, 71, 9600610 is available at https://dx.doi.org/10.1109/TIM.2022.3188031.en_US
dc.subjectCircular arrayen_US
dc.subjectCrack damageen_US
dc.subjectCross-scanning methoden_US
dc.subjectLamb waveen_US
dc.subjectPZTen_US
dc.subjectQuantitative monitoringen_US
dc.titleA cross-scanning crack damage quantitative monitoring and imaging methoden_US
dc.typeJournal/Magazine Articleen_US
dc.identifier.volume71en_US
dc.identifier.doi10.1109/TIM.2022.3188031en_US
dcterms.abstractQuantitative crack monitoring and detection is one of the focuses of attention to structural health monitoring due to its concealment and harmfulness. However, in the existing guided wave-and PZT-sensor-array-based structural health-monitoring approaches, the crack orientation information is often ignored, which is a key issue in crack monitoring, making it hard to effectively evaluate the crack damage. In this study, the circular piezoelectric array and active Lamb wave RAPID imaging technology are introduced and improved to study the quantitative monitoring of crack damage. A cross-scanning method is proposed to determine the crack orientation based on response signal variations of different degrees on monitoring paths with different angles. Accordingly, the signal difference coefficient (SDC) value of the detected monitoring paths of parallel or approximately parallel crack damage is corrected to strengthen the reconstruction information of crack orientation. After that, image reconstruction and quantitative evaluation of crack damage can be realized based on the enhanced SDC information. Several experiments are carried out on the aluminum plate to validate the proposed method. The cracks at different positions and orientations are monitored and evaluated through the proposed method. The experimental results show that crack orientation can be well identified through the proposed cross-scanning crack monitoring and imaging method.en_US
dcterms.accessRightsopen accessen_US
dcterms.bibliographicCitationIEEE transactions on instrumentation and measurement, 2022, v. 71, 9600610en_US
dcterms.isPartOfIEEE transactions on instrumentation and measurementen_US
dcterms.issued2022-
dc.identifier.scopus2-s2.0-85134215422-
dc.identifier.eissn1557-9662en_US
dc.identifier.artn9600610en_US
dc.description.validate202306 bcwwen_US
dc.description.oaAuthor’s Originalen_US
dc.identifier.FolderNumbera2143a-
dc.identifier.SubFormID46767-
dc.description.fundingSourceSelf-fundeden_US
dc.description.pubStatusPublisheden_US
dc.description.oaCategoryGreen (AO)en_US
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