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Title: Imaging delamination in composite laminates using perturbation to steady-state wavefields
Authors: Xu, W 
Cao, M
Su, Z 
Xu, H
Radzieński, M
Ostachowicz, W
Issue Date: Jul-2021
Source: Smart materials and structures, July 2021, v. 30, no. 7, 75023
Abstract: Delamination in composite laminates, though barely visible, can jeopardize integrity and safety of the composite structures. Interaction of guided waves with delamination in full wavefields have been widely used to graphically characterize the delamination. Recently, steady-state wavefields (SWs) in place of transient wavefields have been used for imaging delamination. However, interaction with delamination can be largely obscured by steady-state waves and hardly observed. Addressing this problem, this study proposes a novel approach for imaging delamination using perturbation to SWs. In particular, a new concept of delamination-caused perturbation to a SW is proposed. Compared to scattered waves from delamination, it is determined by delamination only and naturally sensitive to delamination. Delamination-caused perturbation to a SW is concentrated within the delamination region and rapidly attenuates at undamaged locations. On the basis of this new concept, a delamination index (DI) is established for imaging delamination, by which the delamination can be graphically characterized. The capability of the approach is experimentally validated on composite laminates with delamination, whose SWs are acquired through laser scanning. The experimental results validate that delamination imaging can be achieved by DIs, by which the occurrence, locations, and sizes of the delamination can be graphically characterized.
Keywords: Composite laminate
Delamination
Delamination index
Laser scanning
Steady-state wavefield
Wavenumber filtering
Publisher: Institute of Physics Publishing
Journal: Smart materials and structures 
ISSN: 0964-1726
EISSN: 1361-665X
DOI: 10.1088/1361-665X/ac0090
Rights: © 2021 IOP Publishing Ltd
This is the Accepted Manuscript version of an article accepted for publication in Smart Materials and Structures. IOP Publishing Ltd is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The Version of Record is available online at https://dx.doi.org/10.1088/1361-665X/ac0090.
This manuscript version is made available under the CC-BY-NC-ND 4.0 license (https://creativecommons.org/licenses/by-nc-nd/4.0/).
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