Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/96976
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Title: Environmentally tolerant ionic hydrogel with high power density for low-grade heat harvesting
Authors: Chen, J
Shi, C
Wu, L
Deng, Y
Wang, Y
Zhang, L
Zhang, Q
Peng, F
Tao, XM 
Zhang, M
Zeng, W
Issue Date: 3-Aug-2022
Source: ACS applied materials and interfaces, 3 Aug. 2022, v. 14, no. 30, p. 34714-34721
Abstract: Harvesting low-grade heat by an ionic hydrogel thermoelectric generator (ITEG) into useful electricity is promising to power flexible electronics. However, the poor environmental tolerance of the ionic hydrogel limits its application. Herein, we demonstrate an ITEG with high thermoelectric properties, as well as excellent capabilities of water retention, freezing resistance, and self-regeneration. The obtained ITEG can maintain the original water content at ambient conditions (302 K, 65% relative humidity (RH)) for 7 days and keep unfreezing at a low temperature (253 K). It can even be self-regenerated and recovered to its original state after a water loss in high-temperature conditions. Furthermore, a high ionic Seebeck coefficient of 11.3 mV K-1 and an impressive power density of 167.90 mW m-2 are achieved under a temperature difference of 20 K. A high power density of 60.00 mW m-2 can also be maintained even at 258 K. After drying and regeneration, ITEG-re could even exhibit a higher ionic Seebeck coefficient of 11.8 mV K-1. Successful lighting of light-emitting diodes (LEDs) and charging of capacitors demonstrate the great potential of ITEG to provide continuous energy supply for powering flexible electronics.
Keywords: Environmental tolerance
Flexible electronics
Ionic hydrogel thermoelectric generator
Low-grade heat
Self-regeneration
Publisher: American Chemical Society
Journal: ACS applied materials and interfaces 
ISSN: 1944-8244
EISSN: 1944-8252
DOI: 10.1021/acsami.2c07423
Rights: © 2022 American Chemical Society
This document is the Accepted Manuscript version of a Published Work that appeared in final form in ACS Applied Materials & Interfaces, copyright © American Chemical Society after peer review and technical editing by the publisher. To access the final edited and published work see https://dx.doi.org/10.1021/acsami.2c07423.
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