Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/82217
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dc.contributorDepartment of Industrial and Systems Engineeringen_US
dc.creatorSun, ZWen_US
dc.creatorTo, Sen_US
dc.creatorWang, SJen_US
dc.creatorDu, JJen_US
dc.date.accessioned2020-05-05T05:59:08Z-
dc.date.available2020-05-05T05:59:08Z-
dc.identifier.urihttp://hdl.handle.net/10397/82217-
dc.language.isoenen_US
dc.publisherOptical Society of Americaen_US
dc.rights© 2020 Optical Society of America under the terms of the OSA Open Access Publishing Agreement (https://www.osapublishing.org/library/license_v1.cfm#VOR-OA)en_US
dc.rights© 2020 Optical Society of America. Users may use, reuse, and build upon the article, or use the article for text or data mining, so long as such uses are for non-commercial purposes and appropriate attribution is maintained. All other rights are reserved.en_US
dc.rightsJournal © 2020en_US
dc.rightsThe following publication Zhanwen Sun, Suet To, Sujuan Wang, and Jianjun Du, "Development of self-tuned diamond milling system for fabricating infrared micro-optics arrays with enhanced surface uniformity and machining efficiency," Opt. Express 28, 2221-2237 (2020) is available at https://dx.doi.org/10.1364/OE.382672en_US
dc.titleDevelopment of self-tuned diamond milling system for fabricating infrared micro-optics arrays with enhanced surface uniformity and machining efficiencyen_US
dc.typeJournal/Magazine Articleen_US
dc.identifier.spage2221en_US
dc.identifier.epage2237en_US
dc.identifier.volume28en_US
dc.identifier.issue2en_US
dc.identifier.doi10.1364/OE.382672en_US
dcterms.abstractInfrared micro-optics arrays (MOAs) featuring large numbers of micro-freeform lenslet are required increasingly in advanced infrared optical systems. Ultra-precision diamond cutting technologies have been widely used to fabricate MOAs with high form accuracy. However, the existing technologies can easily cause the non-uniformly fractured surface of infrared MOAs, due to the inherent low fracture toughness and high anisotropy of infrared materials as well as the time-varying chip thickness induced by ever-changing height and slope of the desired MOAs. In this study, a novel self-tuned diamond milling (STDM) system is proposed to achieve the ductile cutting of infrared MOAs with enhanced the surface uniformity and machining efficiency, and the corresponding toolpath planning algorithm is developed. In STDM system, a dual-axial fast servo motion platform is integrated into a raster milling system to self-adaptively match the maximum chip thickness for each tool rotational cycle with the critical depth of cut of the infrared material according to the local surface topography, thereby obtaining crack-free lenslet with high surface uniformity. Practically, micro-aspheric MOAs free from fractures are successfully machined on single-crystal silicon, a typical infrared material, to validate the proposed cutting concept. Compared with the conventional diamond milling, the proposed STDM is demonstrated to be able to avoid the non-uniform fractures without needing to reduce feed rate, and a smaller surface roughness of 4 nm and nearly double machining efficiency are achieved. (C) 2020 Optical Society of America under the terms of the OSA Open Access Publishing Agreementen_US
dcterms.accessRightsopen accessen_US
dcterms.bibliographicCitationOptics express, 2020, v. 28, no. 2, p. 2221-2237en_US
dcterms.isPartOfOptics expressen_US
dcterms.issued2020-
dc.identifier.isiWOS:000513232200114-
dc.identifier.eissn1094-4087en_US
dc.description.validate202006 bcrcen_US
dc.description.oaVersion of Recorden_US
dc.identifier.FolderNumberOA_Scopus/WOSen_US
dc.description.pubStatusPublisheden_US
dc.description.oaCategoryVoR alloweden_US
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