Two-dimensional array ultrasonic transducer based on three-dimensional ultrasonic imaging and preparation method for same

Abstract

The invention relates to the technical field of three-dimensional ultrasonic imaging and discloses a two-dimensional array ultrasonic transducer based on the three-dimensional ultrasonic imaging and a preparation method for the same. The two-dimensional array ultrasonic transducer comprises an insulated resin frame, an electric-conduction backer board, a piezoelectric plate and a printing circuit board, wherein N*N hollow channels filled with an electric-conduction adhesive are formed in the insulated resin frame; the electric-conduction backer board is disposed on the insulated resin frame; the piezoelectric plate is located on the electric-conduction backer board and comprises N*N piezoelectric array elements; and N*N array row pins which are correspondingly disposed in the N*N hollow channels respectively are disposed on the printing circuit board. By the electric-conduction adhesive, the piezoelectric array elements are electrically connected to the array row pins, so that the problem in complex wiring technologies of the array elements of the two-dimensional ultrasonic transducer is solved, and preparation cost is reduced. Meanwhile, the short-circuited problem happening when an interval between every two piezoelectric array elements is too small during wiring is avoided. In addition, the electric-conduction backer board can absorb useless sound waves on the back face of the piezoelectric plate, so that quality of the two-dimensional array ultrasonic transducer can be improved greatly. 本发明涉及三维超声成像的技术领域，公开了基于三维超声成像的二维阵列超声换能器及其制备方法，二维阵列超声换能器包括绝缘树脂框架、导电背衬板、压电片以及印刷电路板，绝缘树脂框架中具有NxN个填充导电胶的空心通道；导电背衬板设于绝缘树脂框架上；压电片置于导电背衬板上，其中具有NxN个压电阵元；印刷电路板上设有NxN个分别对应置于NxN个所述空心通道中的阵列排针。通过导电胶，将压电阵元与阵列排针电性连接，解决二维阵列超声换能器的阵元复杂的接线工艺，降低制备成本，同时，在接线过程中，由于各压电阵元之间间距过小，避免出现短路的问题；另外，导电背衬板可以吸收压电片背面的无用声波，大大提高二维阵列超声换能器的品质。