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Title: Two-dimensional array ultrasonic transducer based on three-dimensional ultrasonic imaging and preparation method for same
Other Title: 基于三维超声成像的二维阵列超声换能器及其制备方法
Authors: Dai, J 
Fang, H 
Huang, ZW 
Chen, Y 
Issue Date: 17-Jul-2018
Source: 中国专利 ZL 201410617359.3
Abstract: The invention relates to the technical field of three-dimensional ultrasonic imaging and discloses a two-dimensional array ultrasonic transducer based on the three-dimensional ultrasonic imaging and a preparation method for the same. The two-dimensional array ultrasonic transducer comprises an insulated resin frame, an electric-conduction backer board, a piezoelectric plate and a printing circuit board, wherein N*N hollow channels filled with an electric-conduction adhesive are formed in the insulated resin frame; the electric-conduction backer board is disposed on the insulated resin frame; the piezoelectric plate is located on the electric-conduction backer board and comprises N*N piezoelectric array elements; and N*N array row pins which are correspondingly disposed in the N*N hollow channels respectively are disposed on the printing circuit board. By the electric-conduction adhesive, the piezoelectric array elements are electrically connected to the array row pins, so that the problem in complex wiring technologies of the array elements of the two-dimensional ultrasonic transducer is solved, and preparation cost is reduced. Meanwhile, the short-circuited problem happening when an interval between every two piezoelectric array elements is too small during wiring is avoided. In addition, the electric-conduction backer board can absorb useless sound waves on the back face of the piezoelectric plate, so that quality of the two-dimensional array ultrasonic transducer can be improved greatly.
Publisher: 中华人民共和国国家知识产权局
Rights: 专利权人: 香港理工大学深圳研究院
Appears in Collections:Patent

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