Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/82087
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dc.contributorDepartment of Applied Physics-
dc.creatorDai, Jen_US
dc.creatorFang, Hen_US
dc.creatorHuang, ZWen_US
dc.creatorChen, Yen_US
dc.date.accessioned2020-05-05T05:58:36Z-
dc.date.available2020-05-05T05:58:36Z-
dc.identifier.urihttp://hdl.handle.net/10397/82087-
dc.language.isozhen_US
dc.publisher中华人民共和国国家知识产权局en_US
dc.rights专利权人: 香港理工大学深圳研究院en_US
dc.titleTwo-dimensional array ultrasonic transducer based on three-dimensional ultrasonic imaging and preparation method for sameen_US
dc.typePatenten_US
dc.description.otherinformationInventor name used in this publication: 戴吉岩en_US
dc.description.otherinformationInventor name used in this publication: 方华靖en_US
dc.description.otherinformationInventor name used in this publication: 黄智文en_US
dc.description.otherinformationInventor name used in this publication: 陈燕en_US
dc.description.otherinformationTitle in Traditional Chinese: 基於三維超聲成像的二維陣列超聲換能器及其製備方法en_US
dcterms.abstractThe invention relates to the technical field of three-dimensional ultrasonic imaging and discloses a two-dimensional array ultrasonic transducer based on the three-dimensional ultrasonic imaging and a preparation method for the same. The two-dimensional array ultrasonic transducer comprises an insulated resin frame, an electric-conduction backer board, a piezoelectric plate and a printing circuit board, wherein N*N hollow channels filled with an electric-conduction adhesive are formed in the insulated resin frame; the electric-conduction backer board is disposed on the insulated resin frame; the piezoelectric plate is located on the electric-conduction backer board and comprises N*N piezoelectric array elements; and N*N array row pins which are correspondingly disposed in the N*N hollow channels respectively are disposed on the printing circuit board. By the electric-conduction adhesive, the piezoelectric array elements are electrically connected to the array row pins, so that the problem in complex wiring technologies of the array elements of the two-dimensional ultrasonic transducer is solved, and preparation cost is reduced. Meanwhile, the short-circuited problem happening when an interval between every two piezoelectric array elements is too small during wiring is avoided. In addition, the electric-conduction backer board can absorb useless sound waves on the back face of the piezoelectric plate, so that quality of the two-dimensional array ultrasonic transducer can be improved greatly.-
dcterms.abstract本发明涉及三维超声成像的技术领域,公开了基于三维超声成像的二维阵列超声换能器及其制备方法,二维阵列超声换能器包括绝缘树脂框架、导电背衬板、压电片以及印刷电路板,绝缘树脂框架中具有NxN个填充导电胶的空心通道;导电背衬板设于绝缘树脂框架上;压电片置于导电背衬板上,其中具有NxN个压电阵元;印刷电路板上设有NxN个分别对应置于NxN个所述空心通道中的阵列排针。通过导电胶,将压电阵元与阵列排针电性连接,解决二维阵列超声换能器的阵元复杂的接线工艺,降低制备成本,同时,在接线过程中,由于各压电阵元之间间距过小,避免出现短路的问题;另外,导电背衬板可以吸收压电片背面的无用声波,大大提高二维阵列超声换能器的品质。-
dcterms.alternative基于三维超声成像的二维阵列超声换能器及其制备方法en_US
dcterms.bibliographicCitation中国专利 ZL 201410617359.3en_US
dcterms.issued2018-07-17-
dc.description.countryChina-
dc.identifier.rosgroupid2018002610-
dc.description.ros2018-2019 > Other Outputs > Patents granted-
dc.description.validate202006 bcrc-
dc.description.oaVersion of Recorden_US
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