Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/82
| Title: | Cobalt-molybdenum-phosphorus alloy diffusion barrier coatings | Authors: | Man, HC Ng, WY Yeung, CH Lee, CY Siu, CL Tsui, RYC Yeung, KLK |
Issue Date: | 4-Mar-2003 | Source: | US Patent 6,528,184 B2. Washington, DC: US Patent and Trademark Office, 2003. | Abstract: | Techniques are provided for electrolessly depositing and electrodepositing a CoMoP barrier coating onto copper or copper alloys to prevent copper diffusion when forming gold layers on articles such as watch bracelets, watch cases, imitation jewellery, spectacle frames, and metal buttons. | Keywords: | Cobalt-molybdenum-phosphorus alloy Barrier coatings |
Rights: | Assignee: The Hong Kong Polytechnic University. Assignee: Hong Kong Productivity Council. |
| Appears in Collections: | Patent |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| us006528184b2.pdf | 289.79 kB | Adobe PDF | View/Open |
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