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dc.contributorDepartment of Applied Biology and Chemical Technology-
dc.contributorDepartment of Industrial and Systems Engineering-
dc.creatorMan, HC-
dc.creatorNg, WY-
dc.creatorYeung, CH-
dc.creatorLee, CY-
dc.creatorSiu, CL-
dc.creatorTsui, RYC-
dc.creatorYeung, KLK-
dc.rightsAssignee: The Hong Kong Polytechnic University.en_US
dc.rightsAssignee: Hong Kong Productivity Council.en_US
dc.subjectCobalt-molybdenum-phosphorus alloyen_US
dc.subjectBarrier coatingsen_US
dc.titleCobalt-molybdenum-phosphorus alloy diffusion barrier coatingsen_US
dc.description.otherinformationInventor name used in this publication: Hau-chung Manen_US
dc.description.otherinformationUS6528184; US6528184 B2; US6528184B2; US6,528,184; US 6,528,184 B2; 6528184; Application No. 09/794,390en_US
dcterms.abstractTechniques are provided for electrolessly depositing and electrodepositing a CoMoP barrier coating onto copper or copper alloys to prevent copper diffusion when forming gold layers on articles such as watch bracelets, watch cases, imitation jewellery, spectacle frames, and metal buttons.-
dcterms.bibliographicCitationUS Patent 6,528,184 B2. Washington, DC: US Patent and Trademark Office, 2003.-
dc.description.oaVersion of Recorden_US
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