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Title: Reduction of minimum cutting thickness of titanium alloys in micro cutting by a magnetic field assistance
Authors: Yip, WS 
To, S 
Issue Date: 2019
Source: IEEE access, 4 Oct. 2019, v. 7, p. 152034-152041
Abstract: Ultra-precision diamond cutting (UPDC) is a promising machining technology to generate precise components with optical grade surface. However, a tool rake angle turns to be negative when the tool radius is significantly larger than cutting depth during UPDC. The resulted plowing motion, which is the well-known size effect, causes undeformed and uncut materials remaining on the machined surface and thus affects the surface integrity of final components. In this study, the tribology behavior of tool/workpiece was altered in order to resolve the problematic size effect. A magnetic field was superimposed into titanium alloys during UPDC to increase the friction coefficient at the tool/workpiece interface in order to minimize the size effect and reduce minimum chip thickness (MCT) in UPDC. The experimental results showed the friction coefficient at the tool/workpiece interface increased under the magnetic field influence and a better surface quality was achieved in the presence of magnetic field. MCT of titanium alloys was reduced to by utilizing the proposed machining technology which the reduction percentage reached to A lower MCT value means the feasibility of machining under smaller depth of cut and thus enhances the existing precise level of components fabricated in ultra-precision machining.
Keywords: Titanium alloys
Precision machining
Magnetic field
Publisher: Institute of Electrical and Electronics Engineers
Journal: IEEE access 
ISSN: 2169-3536
DOI: 10.1109/ACCESS.2019.2945526
Rights: This work is licensed under a Creative Commons Attribution 4.0 License. For more information, see
The following publication W. S. Yip and S. To, "Reduction of Minimum Cutting Thickness of Titanium Alloys in Micro Cutting by a Magnetic Field Assistance," in IEEE Access, vol. 7, pp. 152034-152041, 2019 is available at
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