Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/572
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dc.contributorDepartment of Applied Physics-
dc.creatorCheng, KC-
dc.creatorPeng, Z-
dc.creatorWong, CS-
dc.creatorChan, HLW-
dc.date.accessioned2014-12-11T08:25:18Z-
dc.date.available2014-12-11T08:25:18Z-
dc.identifier.isbn0-7803-7560-2-
dc.identifier.urihttp://hdl.handle.net/10397/572-
dc.language.isoenen_US
dc.publisherIEEEen_US
dc.rights© 2002 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.en_US
dc.rightsThis material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.en_US
dc.subjectActivation energyen_US
dc.subjectAluminumen_US
dc.subjectDielectric relaxationen_US
dc.subjectDifferential scanning calorimetryen_US
dc.subjectElectric current measurementen_US
dc.subjectElectric propertiesen_US
dc.subjectElectronics packagingen_US
dc.subjectGlass transitionen_US
dc.subjectMicroelectronic processingen_US
dc.subjectTemperatureen_US
dc.titleTSDC measurements of underfill encapsulant used in microelectronic packagingen_US
dc.typeConference Paperen_US
dc.description.otherinformationAuthor name used in this publication: K. C. Chengen_US
dc.description.otherinformationRefereed conference paperen_US
dcterms.abstractThe thermal stimulated depolarization current (TSDC) technique was used to study the dielectric relaxation of underfill encapsulant used in microelectronic packaging. The dependence of electrical properties of the underfill on the polarizing temperature, polarizing field and heating rate were analyzed from the TSDC spectra as a function of temperature. A single α-relaxation peak associated with the glass transition temperature T[sub g] of the underfill was observed. A value of Tg can be estimated which can be compared to the T[sub g] determined by differential scanning calorimetry (DSC). The activation energy and relaxation time of the dielectric relaxation of the underfill were determined from the TSDC measurements.-
dcterms.accessRightsopen accessen_US
dcterms.bibliographicCitation11th International Symposium on Electrets (ISE 11) : 1-3 October, 2002, Glen Waverley, Melbourne, Australia : proceedings, p. 71-74-
dcterms.issued2002-
dc.identifier.isiWOS:000179971700017-
dc.identifier.scopus2-s2.0-0036954437-
dc.identifier.rosgroupidr11782-
dc.description.ros2002-2003 > Academic research: refereed > Refereed conference paper-
dc.description.oaVersion of Recorden_US
dc.identifier.FolderNumberOA_IR/PIRAen_US
dc.description.pubStatusPublisheden_US
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