Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/55947
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dc.contributorInstitute of Textiles and Clothingen_US
dc.contributorMainland Development Officeen_US
dc.creatorGuo, Ren_US
dc.creatorYu, Yen_US
dc.creatorZeng, Jen_US
dc.creatorLiu, Xen_US
dc.creatorZhou, Xen_US
dc.creatorNiu, Len_US
dc.creatorGao, Ten_US
dc.creatorLi, Ken_US
dc.creatorYang, Yen_US
dc.creatorZhou, Fen_US
dc.creatorZheng, Zen_US
dc.date.accessioned2016-09-29T02:19:24Z-
dc.date.available2016-09-29T02:19:24Z-
dc.identifier.issn2198-3844en_US
dc.identifier.urihttp://hdl.handle.net/10397/55947-
dc.language.isoenen_US
dc.publisherWiley-VCHen_US
dc.rights© 2015 The Authors. Published by WILEY-VCH Verlag GmbH & Co. KGaA, Weinheimen_US
dc.rightsThis is an open access article under the terms of the Creative Commons Attribution License (https://creativecommons.org/licenses/by/4.0/), which permits use, distribution and reproduction in any medium, provided the original work is properly cited.en_US
dc.rightsThe following publication Guo, R., Yu, Y., Zeng, J., Liu, X., Zhou, X., Niu, L., Gao, T., Li, K., Yang, Y., Zhou, F., Zheng, Z. (2015). Biomimicking Topographic Elastomeric Petals (E-Petals) for Omnidirectional Stretchable and Printable Electronics. Adv. Sci., 2: 1400021 is available at https://doi.org/10.1002/advs.201400021.en_US
dc.titleBiomimicking topographic Elastomeric Petals (E-petals) for omnidirectional stretchable and printable electronicsen_US
dc.typeJournal/Magazine Articleen_US
dc.identifier.spage1en_US
dc.identifier.epage9en_US
dc.identifier.volume2en_US
dc.identifier.issue3en_US
dc.identifier.doi10.1002/advs.201400021en_US
dcterms.abstractElastomeric petals directly replicated from natural rose petal are new versatile substrates for stretchable and printable electronics. Compared with conventional flat polydimethylsiloxane substrates, elastomeric petals have biomimicking topographic surfaces that can effectively inhibit the propagation of microcracks formed in the conducting layer, which is deposited on top, regardless of the type of conductive materials and the deposition methods.en_US
dcterms.accessRightsopen accessen_US
dcterms.bibliographicCitationAdvanced science, Mar. 2015, v. 2, no. 3, 1400021, p. 1-9en_US
dcterms.isPartOfAdvanced scienceen_US
dcterms.issued2015-03-
dc.identifier.rosgroupid2014004195-
dc.description.ros2014-2015 > Academic research: refereed > Publication in refereed journalen_US
dc.description.oaVersion of Recorden_US
dc.identifier.FolderNumberRGC-B3-1473-
dc.description.fundingSourceRGCen_US
dc.description.fundingSourceOthersen_US
dc.description.fundingTextHong Kong Polytechnic University (Projects 1-ZV5Z and A-SA74); NSFC (21125316, 21434009)en_US
dc.description.pubStatusPublisheden_US
dc.description.oaCategoryCCen_US
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