Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/4879
DC Field | Value | Language |
---|---|---|
dc.contributor | Department of Mechanical Engineering | - |
dc.creator | Huang, H | - |
dc.creator | Woo, CH | - |
dc.creator | Wei, HL | - |
dc.creator | Zhang, XX | - |
dc.date.accessioned | 2014-12-11T08:24:48Z | - |
dc.date.available | 2014-12-11T08:24:48Z | - |
dc.identifier.issn | 0003-6951 | - |
dc.identifier.uri | http://hdl.handle.net/10397/4879 | - |
dc.language.iso | en | en_US |
dc.publisher | American Institute of Physics | en_US |
dc.rights | © 2003 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The following article appeared in H. Huang et al., Appl. Phys. Lett. 82, 1272 (2003) and may be found at http://link.aip.org/link/?apl/82/1272 | en_US |
dc.subject | Copper | en_US |
dc.subject | Metallic thin films | en_US |
dc.subject | Surface structure | en_US |
dc.subject | Sputter deposition | en_US |
dc.subject | Molecular dynamics method | en_US |
dc.subject | Nanostructured materials | en_US |
dc.subject | Scanning electron microscopy | en_US |
dc.subject | X-ray diffraction | en_US |
dc.subject | Surface diffusion | en_US |
dc.subject | Surfactants | en_US |
dc.subject | Conformal coatings | en_US |
dc.title | Kinetics-limited surface structures at the nanoscale | en_US |
dc.type | Journal/Magazine Article | en_US |
dc.description.otherinformation | Author name used in this publication: C. H. Woo | en_US |
dc.identifier.spage | 1 | - |
dc.identifier.epage | 3 | - |
dc.identifier.volume | 82 | - |
dc.identifier.issue | 8 | - |
dc.identifier.doi | 10.1063/1.1555278 | - |
dcterms.abstract | This letter presents the evolution of kinetics-limited nanoscale structures during copper thin film deposition. We first calculate the three-dimensional Ehrlich–Schwoebel (3D ES) kinetic barrier of copper using the molecular dynamics/statics method. Based on this calculation, the dimension of {111} facets, under typical sputtering deposition conditions, is estimated to be 700 nm if the 3D ES barrier is effective, in contrast to 70 μm without it. Accompanying the calculations, we deposit copper 〈111〉 columns using the magnetron sputtering technique, and characterize their structures using scanning electron microscopy and x-ray diffraction techniques. The observed facets of pure copper films are on the order of 200 nm in dimension, confirming that surface structure is controlled by the 3D ES kinetic barrier. When indium is introduced as surfactant, the facet dimension increases, leading to conformal films; this is attributed to reduction of the 3D ES barrier. | - |
dcterms.accessRights | open access | en_US |
dcterms.bibliographicCitation | Applied physics letters, 24 Feb. 2003, v. 82, no. 8, 1272, p. 1-3 | - |
dcterms.isPartOf | Applied physics letters | - |
dcterms.issued | 2003-02-24 | - |
dc.identifier.isi | WOS:000181066000044 | - |
dc.identifier.scopus | 2-s2.0-0037463294 | - |
dc.identifier.eissn | 1077-3118 | - |
dc.identifier.rosgroupid | r13176 | - |
dc.description.ros | 2002-2003 > Academic research: refereed > Publication in refereed journal | - |
dc.description.oa | Version of Record | en_US |
dc.identifier.FolderNumber | OA_IR/PIRA | en_US |
dc.description.pubStatus | Published | en_US |
dc.description.oaCategory | VoR allowed | en_US |
Appears in Collections: | Journal/Magazine Article |
Files in This Item:
File | Description | Size | Format | |
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Huang_Kinetics-limited_Surface_Nanoscale.pdf | 364.36 kB | Adobe PDF | View/Open |
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