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Title: Magnetic field-induced strain and magnetoelectric effects in sandwich composite of ferromagnetic shape memory Ni-Mn-Ga crystal and piezoelectric PVDF polymer
Authors: Zeng, M
Or, DSW 
Chan, HLW 
Issue Date: Oct-2010
Source: IEEE transactions on ultrasonics, ferroelectrics, and frequency control, Oct. 2010, v. 57, no, 10, p. 2147-2153
Abstract: A sandwich composite consisting of one layer of ferromagnetic shape memory Ni-Mn-Ga crystal plate bonded between two layers of piezoelectric PVDF polymer film was fabricated, and its magnetic field-induced strain (MFIS) and magnetoelectric (ME) effects were investigated, together with a monolithic Ni-Mn-Ga crystal, as functions of magnetic fields and mechanical load. The load-free dc- and ac-MFISs were 0.35 and 0.05% in the composite, and 5.6 and 0.3% in the monolithic crystal, respectively. The relatively smaller load-free MFISs in the composite than the monolithic crystal resulted from the clamping of martensitic twin-boundary motion in the Ni-Mn-Ga plate by the PVDF films. The largest ME coefficient (αE) was 0.58 V/cm·Oe at a magnetic bias field (H[sub Bias]) of 8.35 kOe under load-free condition. The mechanism of the ME effect originated from the mechanically mediated MFIS effect in the Ni-Mn-Ga plate and piezoelectric effect in the PVDF films. The measured αE–H[sub Bias] responses under different loads showed good agreement with the model prediction.
Keywords: Composite materials
Ferromagnetic materials
Gallium alloys
Magnetoelastic effects
Magnetoelectric effects
Manganese alloys
Martensitic structure
Nickel alloys
Piezoelectric materials
Piezoelectric thin films
Polymer films
Sandwich structures
Shape memory effects
Twin boundaries
Publisher: Institute of Electrical and Electronics Engineers
Journal: IEEE transactions on ultrasonics, ferroelectrics, and frequency control 
ISSN: 0885-3010
EISSN: 1525-8955
DOI: 10.1109/TUFFC.2010.1671
Rights: © 2010 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
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