Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/119204
DC FieldValueLanguage
dc.contributorDepartment of Mechanical Engineeringen_US
dc.creatorHu, Yen_US
dc.creatorTamtaji, Men_US
dc.creatorDai, Men_US
dc.creatorTang, TWen_US
dc.creatorShen, Jen_US
dc.creatorWang, Jen_US
dc.creatorGao, Zen_US
dc.creatorZhang, Nen_US
dc.creatorAn, Len_US
dc.creatorLuo, Zen_US
dc.date.accessioned2026-06-09T08:45:06Z-
dc.date.available2026-06-09T08:45:06Z-
dc.identifier.issn2590-2393en_US
dc.identifier.urihttp://hdl.handle.net/10397/119204-
dc.language.isoenen_US
dc.publisherCell Pressen_US
dc.subject1Tʹ/2H-MoTe₂ homojunctionen_US
dc.subjectAsymmetric contactsen_US
dc.subjectAtomic-scale channelen_US
dc.subjectCrossbar arrayen_US
dc.subjectVan der Waals integrationen_US
dc.titleVan der Waals-integrated crossbar arrays with adjustable atomic-scale channels for ultralow-power imagingen_US
dc.typeJournal/Magazine Articleen_US
dc.identifier.volume9en_US
dc.identifier.issue3en_US
dc.identifier.doi10.1016/j.matt.2025.102618en_US
dcterms.abstractThe van der Waals (vdWs) integration of two-dimensional (2D) materials offers a versatile fabrication possibility for next-generation image sensors. However, there is a conflict between the desired small channel length and lateral device structures, superseding the depletion region, with a large footprint. Here, we propose a vdWs-integrated crossbar array structure utilizing a vertical 1T′/2H-MoTe₂/ITO structure for visible and near-infrared imaging. Such a crossbar design employs 2H-MoTe₂ layers as a vertical and adjustable atomic-scale channel with a large illumination area, which in turn effectively enhances the photoresponse. Additionally, the asymmetric electrode contacts consist of an ohmic contact in the 1T′/2H-MoTe₂ homojunction and a Schottky contact on the other side, contributing to self-powered photodetection. With these designs, the self-powered responsivity and detectivity reach 4.6 A W⁻¹ and 5.8 × 10¹³ cm Hz¹ᐟ²W⁻¹ with 23-nm channel thickness. This vdWs-integrated image sensor provides an alternative strategy for solving optimal performance and integration problems of 2D materials for the advancement of optoelectronics.en_US
dcterms.accessRightsembargoed accessen_US
dcterms.bibliographicCitationMatter, 4 Mar. 2026, v. 9, no. 3, 102618en_US
dcterms.isPartOfMatteren_US
dcterms.issued2026-03-04-
dc.identifier.scopus2-s2.0-105031915557-
dc.identifier.eissn2590-2385en_US
dc.identifier.artn102618en_US
dc.description.validate202606 bchyen_US
dc.description.oaNot applicableen_US
dc.identifier.SubFormIDG001811/2026-05-
dc.description.fundingSourceRGCen_US
dc.description.fundingSourceOthersen_US
dc.description.fundingTextThe work described in this paper was conducted in part by Dr. Yunxia Hu, JC STEM Early Career Research Fellow, supported by the Hong Kong Jockey Club Charities Trust . This work was supported by funding from the Research Grants Council of the Hong Kong Special Administrative Region , China ( F-HKUST602/23 and E-HKUST601/23 ), Innovation and Technology Commission (grant ITC-CNERC14SC01 ), and the International Science and Technology Cooperation projects of Science and Technological Bureau of Guangzhou Huangpu District ( 2022GH05 ). We acknowledge the Materials Characterization and Preparation Facility (MCPF) and the Nanosystem Fabrication Facility (CWB) of HKUST for their assistance.en_US
dc.description.pubStatusPublisheden_US
dc.date.embargo2027-03-04en_US
dc.description.oaCategoryGreen (AAM)en_US
Appears in Collections:Journal/Magazine Article
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Embargo End Date 2027-03-04
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