Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/117536
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dc.contributorDepartment of Mechanical Engineering-
dc.creatorWu, Zen_US
dc.creatorWang, Zen_US
dc.date.accessioned2026-02-26T03:46:41Z-
dc.date.available2026-02-26T03:46:41Z-
dc.identifier.urihttp://hdl.handle.net/10397/117536-
dc.language.isoenen_US
dc.publisherInnovation Pressen_US
dc.rights© 2025 The Author(s). This is an open access article under the CC BY license (https://creativecommons.org/licenses/by/4.0/).en_US
dc.rightsThe following publication Wu Z. and Wang Z. (2025). Cooling next-generation electronics: From emerging semiconductors to data centers. The Innovation Energy 2:100125 is available at https://doi.org/10.59717/j.xinn-energy.2025.100125.en_US
dc.titleCooling next-generation electronics : from emerging semiconductors to data centersen_US
dc.typeEditorial/Preface (Journal)en_US
dc.identifier.volume2en_US
dc.identifier.issue4en_US
dc.identifier.doi10.59717/j.xinn-energy.2025.100125en_US
dcterms.accessRightsopen accessen_US
dcterms.bibliographicCitationThe innovation energy, 13 Oct. 2025, v. 2, no. 4, 100125en_US
dcterms.isPartOfThe innovation energyen_US
dcterms.issued2025-10-13-
dc.identifier.scopus2-s2.0-105019682629-
dc.identifier.eissn3006-418Xen_US
dc.identifier.artn100125en_US
dc.description.validate202602 bcch-
dc.description.oaVersion of Recorden_US
dc.identifier.FolderNumberOA_Scopus/WOS-
dc.description.fundingSourceRGCen_US
dc.description.fundingSourceOthersen_US
dc.description.fundingTextThe authors acknowledge the financial support from the National Natural Science Foundation of China (Nos. T2293694, 52333015, 52206100), National Key Research and Development Program of China (No. 2023YFE0209900), Research Grants Council of Hong Kong (Nos.15237824, SRFS2223-1S01, 11215523, N_PolyU5172/24), the Innovation and Technology Commission of Hong Kong (No. MHP/025/23), Meituan Foundation through the Green Tech Award, and Research, Academic and Industry Sectors One-plus Scheme (No. RAI/23/1/094A). The funders had no role in study design, data collection and analysis, decision to publish, or preparation of the manuscript.en_US
dc.description.pubStatusPublisheden_US
dc.description.oaCategoryCCen_US
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