Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/117441
DC FieldValueLanguage
dc.contributorDepartment of Industrial and Systems Engineeringen_US
dc.creatorZhang, Zen_US
dc.creatorYuan, Sen_US
dc.creatorCheung, CFen_US
dc.creatorWu, Wen_US
dc.creatorLi, Zen_US
dc.creatorLi, Ken_US
dc.creatorWang, Cen_US
dc.date.accessioned2026-02-26T01:04:09Z-
dc.date.available2026-02-26T01:04:09Z-
dc.identifier.issn0924-0136en_US
dc.identifier.urihttp://hdl.handle.net/10397/117441-
dc.language.isoenen_US
dc.publisherElsevieren_US
dc.subjectAtomic and close-to-atomic scale manufacturingen_US
dc.subjectChemical mechanical polishingen_US
dc.subjectComplex surfacesen_US
dc.subjectJet polishingen_US
dc.subjectSubsurface damageen_US
dc.titleHigh-efficiency submerged air jet chemical mechanical polishing at the atomic and close-to-atomic scaleen_US
dc.typeJournal/Magazine Articleen_US
dc.identifier.volume348en_US
dc.identifier.doi10.1016/j.jmatprotec.2025.119195en_US
dcterms.abstractFluid jet polishing (FJP) has demonstrated significant potential for polishing and figuring of surfaces with complex geometries owing to its flexibility and shape-adaptive capacity, particularly in high-precision optical applications such as X-ray reflectors, extreme ultraviolet lithography, and super-resolution imaging. Despite its advantages, FJP faces two major challenges that hinder its large-scale industrial adoption. The first challenge is the trade-off between surface quality and material removal efficiency. FJP relies solely on the mechanical impacts of abrasives for material removal, leaving erosion pits on the polished surface. Consequently, existing techniques struggle to achieve sub-nanometer precision while maintaining efficient material removal rates. The second challenge arises from the brittle fracture of materials during the FJP process, complicating the achievement of ultra-smooth surfaces with minimal subsurface damage. To address these limitations, this study introduces Submerged Air Jet Chemical Mechanical Polishing (SAJCMP). This method incorporates a novel material removal mechanism, referred to as “nano-reactive-abrasive-laden droplet-induced chemical mechanical removal,” which enables atomic and close-to-atomic precision while significantly improving polishing efficiency. The multi-scale material removal mechanism is elucidated through both experimental investigations and molecular dynamics (MD) simulations. Furthermore, the influence of various polishing parameters on the synergistic effects of chemical and mechanical actions is analyzed using computational fluid dynamics (CFD) simulations, complemented by experimental validation. Polishing experiments conducted on structured arrays and curved surfaces demonstrated that SAJCMP significantly enhances surface quality, preserves form accuracy, and minimizes subsurface damage.en_US
dcterms.accessRightsembargoed accessen_US
dcterms.bibliographicCitationJournal of materials processing technology, Feb. 2026, v. 348, 119195en_US
dcterms.isPartOfJournal of materials processing technologyen_US
dcterms.issued2026-02-
dc.identifier.scopus2-s2.0-105026858755-
dc.identifier.eissn1873-4774en_US
dc.identifier.artn119195en_US
dc.description.validate202602 bchyen_US
dc.description.oaNot applicableen_US
dc.identifier.SubFormIDG001024/2026-02-
dc.description.fundingSourceRGCen_US
dc.description.fundingSourceOthersen_US
dc.description.fundingTextThe work described in this paper was mainly supported by a grant from the Research Grants Council (Project No. 15205423 ) and Innovation and Technology Commission (ITC) (Project code: MHP/151/2 ) of the Government of the Hong Kong Special Administrative Region, China, the Science, Technology, and Innovation Commission of Shenzhen Municipality (Project No: SGDX20220530110804030 ), and the research studentships (Project codes: RK3M ). The authors acknowledge the Beijing Super Cloud Computing Center (BSCC) for providing HPC resources that have contributed to the research results reported in this paper.en_US
dc.description.pubStatusPublisheden_US
dc.date.embargo2028-02-29en_US
dc.description.oaCategoryGreen (AAM)en_US
Appears in Collections:Journal/Magazine Article
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Embargo End Date 2028-02-29
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