Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/116041
| DC Field | Value | Language |
|---|---|---|
| dc.contributor | Research Institute for Advanced Manufacturing | - |
| dc.contributor | Department of Mechanical Engineering | - |
| dc.creator | Chen, J | - |
| dc.creator | Liu, M | - |
| dc.creator | Liu, M | - |
| dc.creator | Wang, X | - |
| dc.creator | Su, Y | - |
| dc.creator | Zheng, G | - |
| dc.date.accessioned | 2025-11-18T06:49:16Z | - |
| dc.date.available | 2025-11-18T06:49:16Z | - |
| dc.identifier.issn | 2096-5001 | - |
| dc.identifier.uri | http://hdl.handle.net/10397/116041 | - |
| dc.language.iso | en | en_US |
| dc.publisher | Nature Publishing Group | en_US |
| dc.rights | Open Access This article is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License, which permits any non-commercial use, sharing, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if you modified the licensed material. You do not have permission under this licence to share adapted material derived from this article or parts of it. The images or other third party material in this article are included in the article’s Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by-nc-nd/4.0/. | en_US |
| dc.rights | ©TheAuthor(s) 2025 | en_US |
| dc.rights | The following publication Chen, J., Liu, M., Liu, M. et al. Accelerating discovery of next-generation power electronics materials via high-throughput ab initio screening. npj Comput Mater 11, 249 (2025) is available at https://doi.org/10.1038/s41524-025-01745-9. | en_US |
| dc.title | Accelerating discovery of next-generation power electronics materials via high-throughput ab initio screening | en_US |
| dc.type | Journal/Magazine Article | en_US |
| dc.identifier.volume | 11 | - |
| dc.identifier.doi | 10.1038/s41524-025-01745-9 | - |
| dcterms.abstract | Power electronics (PEs) play a pivotal role in electrical energy conversion and regulation for applications spanning from consumer devices to industrial infrastructure. Wide-bandgap (WBG) semiconductors such as SiC, GaN, and Ga2O3 have emerged as high-performance materials in PEs. Nevertheless, the WBG materials have some limitations that there exists the proliferation of intrinsic defects, with prohibitively high fabrication costs. We identify next-generation PEs materials beyond SiC, GaN, and Ga2O3 based on a high-throughput computational methodology. A massive database affording 153,235 materials is screened by leveraging ab initio methods with the thorough evaluation of bandgap, electron mobility, thermal conductivity, and Baliga and Johnson figures of merit (BFOM and JFOM). The comprehensive and effective theoretical analysis identifies some promising candidates (B2O3, BeO, and BN) that possess high BFOM, JFOM, and lattice thermal conductivity. Our methodology could be extended to other application domains of electronics, simplifying the process of exploring new materials. | - |
| dcterms.accessRights | open access | en_US |
| dcterms.bibliographicCitation | NPJ computational materials, 2025, v. 11, 249 | - |
| dcterms.isPartOf | NPJ computational materials | - |
| dcterms.issued | 2025 | - |
| dc.identifier.scopus | 2-s2.0-105012435046 | - |
| dc.identifier.eissn | 2057-3960 | - |
| dc.identifier.artn | 249 | - |
| dc.description.validate | 202511 bcch | - |
| dc.description.oa | Version of Record | en_US |
| dc.identifier.FolderNumber | OA_Scopus/WOS | en_US |
| dc.description.fundingSource | RGC | en_US |
| dc.description.fundingSource | Others | en_US |
| dc.description.fundingText | This work is supported by the Research Grants Council of the Hong Kong Special Administrative Region, China (grant number: 15233823), and the Research Institute for Advanced Manufacturing of the Hong Kong Polytechnic University (project code: 1-CDJV). | en_US |
| dc.description.pubStatus | Published | en_US |
| dc.description.oaCategory | CC | en_US |
| Appears in Collections: | Journal/Magazine Article | |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| s41524-025-01745-9.pdf | 3.01 MB | Adobe PDF | View/Open |
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