Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/115891
PIRA download icon_1.1View/Download Full Text
Title: Thermal comfort of 3D spacer fabric for footwear insole application
Authors: Ning, K 
Yick, KL 
Yu, A 
Yip, J 
Issue Date: 2022
Source: The 15th Textile Bioengineering and Informatics Symposium (TBIS 2022), Online, September 5-8, 2022 (Abstract) (Poster Presentation)
Keywords: Footwear
Insole
Thermal comfort
Description: The 15th Textile Bioengineering and Informatics Symposium (TBIS 2022), Online, September 5-8, 2022
Rights: Posted with permission of the author.
Appears in Collections:Conference Paper

Files in This Item:
File Description SizeFormat 
Lin_Thermal_Comfort_Spacer.pdf663.43 kBAdobe PDFView/Open
Open Access Information
Status open access
File Version Other Version
Show full item record

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.