Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/115663
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dc.contributorDepartment of Industrial and Systems Engineeringen_US
dc.creatorXing, Yen_US
dc.creatorLiu, Yen_US
dc.creatorLi, Yen_US
dc.creatorXue, Cen_US
dc.creatorYip, WSen_US
dc.creatorTo, Sen_US
dc.date.accessioned2025-10-17T02:32:15Z-
dc.date.available2025-10-17T02:32:15Z-
dc.identifier.issn0924-0136en_US
dc.identifier.urihttp://hdl.handle.net/10397/115663-
dc.language.isoenen_US
dc.publisherElsevier BVen_US
dc.subjectAtomic arrangements patternsen_US
dc.subjectDeformation mechanismen_US
dc.subjectHigh-entropy alloyen_US
dc.subjectIn-situ laser-assisted diamond cuttingen_US
dc.subjectMaterial removal featuresen_US
dc.titleTowards understanding the deformation mechanism of high-entropy alloy after in-situ laser-assisted diamond cutting : from macro material removal features to micro atomic arrangement patternsen_US
dc.typeJournal/Magazine Articleen_US
dc.identifier.volume344en_US
dc.identifier.doi10.1016/j.jmatprotec.2025.119009en_US
dcterms.abstractIn-situ laser-assisted diamond cutting (LADC) technology demonstrates significant advantages over conventional diamond cutting (DC) for machining advanced high-performance materials. However, most current research focuses on the improvement of the surface integrity achieved by in-situ LADC, while the understanding of deformation mechanisms remains insufficient and incomplete, especially for novel multi-principal element high-entropy alloy (HEA) materials. To address this research gap, the HEA workpieces subjected to in-situ LADC machining are thoroughly investigated to explore the material transformations under the synergistic effects of the laser energy field and mechanical shearing. Advanced characterization techniques are utilized to systematically analyze the constitutive behavior of HEA materials during in-situ LADC machining, spanning macroscale micrometer-level material removal features to microscale nanometer-level atomic arrangement patterns. The results indicate that, at the macroscopic level, the thermal softening effect of in-situ LADC technology not only enhances the surface quality of processed workpieces due to the improved machinability of HEA materials, but also prevents significant material buildup on the cutting edge of diamond tools. On a microscopic level, compared to the traditional DC processing where the multi-principal element and low stacking fault energy characteristics of HEA materials result in numerous stacking fault defects within the nanocrystalline grains of the near-surface recrystallization layer, the coupled thermal effect of laser-friction in in-situ LADC technology significantly improves the orderliness of atomic arrangements within the nanocrystalline grains. This study advances the fundamental understanding of in-situ LADC-induced material deformation mechanisms in HEA, providing critical insights to accelerate the application of laser-assisted technologies in multi-domain high-performance material processing.en_US
dcterms.accessRightsembargoed accessen_US
dcterms.bibliographicCitationJournal of materials processing technology, Oct. 2025, v. 344, 119009en_US
dcterms.isPartOfJournal of materials processing technologyen_US
dcterms.issued2025-10-
dc.identifier.scopus2-s2.0-105012623314-
dc.identifier.eissn1873-4774en_US
dc.identifier.artn119009en_US
dc.description.validate202510 bcchen_US
dc.description.oaNot applicableen_US
dc.identifier.SubFormIDG000239/2025-08-
dc.description.fundingSourceRGCen_US
dc.description.fundingSourceOthersen_US
dc.description.fundingTextThe work described in this paper was partially supported by the General Research Funds from the Research Grants Council of the Hong Kong Special Administrative Region (HKSAR), China (Project No.: PolyU15221322 and PolyU15206824); Mainland-Hong Kong Joint Funding Scheme (MHKJFS) from Innovation and Technology Commission (ITC) of the Government of HKSAR (Project No.: MHP/051/22); the Special Funding for Jiangsu Province Innovation Support Program (Project No.: BZ2023058). The authors would also like to express their sincere gratitude to the support from the State Key Laboratories in Hong Kong from the ITC of the Government of HKSAR and the Research and Innovation Office of The Hong Kong Polytechnic University.en_US
dc.description.pubStatusPublisheden_US
dc.date.embargo2027-10-31en_US
dc.description.oaCategoryGreen (AAM)en_US
Appears in Collections:Journal/Magazine Article
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Embargo End Date 2027-10-31
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