Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/115592
PIRA download icon_1.1View/Download Full Text
DC FieldValueLanguage
dc.contributorDepartment of Civil and Environmental Engineering-
dc.contributorResearch Institute for Land and Space-
dc.creatorWei, P-
dc.creatorYin, ZY-
dc.creatorHicher, PY-
dc.creatorZheng, Y-
dc.date.accessioned2025-10-08T01:16:51Z-
dc.date.available2025-10-08T01:16:51Z-
dc.identifier.issn0363-9061-
dc.identifier.urihttp://hdl.handle.net/10397/115592-
dc.language.isoenen_US
dc.publisherJohn Wiley & Sons Ltd.en_US
dc.rightsThis is an open access article under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/4.0/), which permits use, distribution and reproduction in any medium, provided the original work is properly cited.en_US
dc.rights© 2025 The Author(s). International Journal for Numerical and Analytical Methods in Geomechanics published by John Wiley & Sons Ltd.en_US
dc.rightsThe following publication P. Wei, Z.-Y. Yin, P.-Y. Hicher, and Y. Zheng, “ Molecular Dynamics Study on Quartz-Indenter Shape and Depth Effects in Epoxy Interfacial Mechanics.” International Journal for Numerical and Analytical Methods in Geomechanics 49, no. 13 (2025): 49, 2949–2964 is available at https://doi.org/10.1002/nag.4021.en_US
dc.subjectFRP–soil interfaceen_US
dc.subjectIndentation depthen_US
dc.subjectIndenter effecten_US
dc.subjectMolecular dynamicsen_US
dc.subjectNanoindentationen_US
dc.subjectNanoscractchingen_US
dc.titleMolecular dynamics study on quartz-indenter shape and depth effects in epoxy interfacial mechanicsen_US
dc.typeJournal/Magazine Articleen_US
dc.identifier.spage2949-
dc.identifier.epage2964-
dc.identifier.volume49-
dc.identifier.issue13-
dc.identifier.doi10.1002/nag.4021-
dcterms.abstractThe interfacial mechanical behavior between epoxy and quartz at the microscale remains inadequately understood. The quartz-indenter shape and indentation depth (hc) effect on epoxy interfacial mechanical behavior has been investigated through molecular dynamics (MD) simulation of nanoindentation and nanoscratching. This work employs two Vickers-type and four spherical indenters with varying radii (R) under different hc conditions, revealing the fundamental deformation mechanisms at the microscale. The reduced modulus and Young's modulus of epoxy resin obtained from MD simulations align well with experimental results. Key findings include: (1) during MD nanoindentation, the elastic-plastic deformation of epoxy and the indentation force increased with rising R and hc, due to the enhanced interfacial interactions between epoxy and quartz. (2) A negative indentation force was observed during the unloading stage, attributed to adhesion effects. (3) In MD nanoscratching, the forces in the y- and z-directions increased with rising R and hc, which was due to a greater contact zone and elastic–plastic deformation. (4) The friction coefficient could increase with rising indentation depth, exceeding 1.0 at hc/R > 0.75. (5) The classic Coulomb's law of friction was not applicable at the microscale or nanoscale. These results provide a foundation for developing interfacial models at the macroscopic scale for engineering applications.-
dcterms.accessRightsopen accessen_US
dcterms.bibliographicCitationInternational journal for numerical and analytical methods in geomechanics, Sept 2025, v. 49, no. 13, p. 2949-2964-
dcterms.isPartOfInternational journal for numerical and analytical methods in geomechanics-
dcterms.issued2025-09-
dc.identifier.scopus2-s2.0-105008181826-
dc.identifier.eissn1096-9853-
dc.description.validate202510 bcch-
dc.description.oaVersion of Recorden_US
dc.identifier.FolderNumberOA_TAen_US
dc.description.fundingSourceRGCen_US
dc.description.fundingSourceOthersen_US
dc.description.fundingTextThe authors thank the Research Grants Council (RGC) of Hong Kong Special Administrative Region Government (HKSARG) of China (Grant Number.: N_PolyU534/20, 15217220), Research Centre for Nature-based, Urban Infrastructure Solutions (Grant Number.: P0053045) of The Hong Kong Polytechnic University, and the Project of RCRE (Grant Number.: 1-BBEM) of The Hong Kong Polytechnic University for the support.en_US
dc.description.pubStatusPublisheden_US
dc.description.TAWiley (2025)en_US
dc.description.oaCategoryTAen_US
Appears in Collections:Journal/Magazine Article
Files in This Item:
File Description SizeFormat 
Wei_Molecular_Dynamics_Study.pdf7.65 MBAdobe PDFView/Open
Open Access Information
Status open access
File Version Version of Record
Access
View full-text via PolyU eLinks SFX Query
Show simple item record

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.