Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/115318
DC FieldValueLanguage
dc.contributorDepartment of Electrical and Electronic Engineering-
dc.creatorZhang, M-
dc.creatorQiu, C-
dc.creatorWang, J-
dc.creatorHuang, X-
dc.creatorZhang, W-
dc.creatorChin, LK-
dc.creatorShang, W-
dc.date.accessioned2025-09-19T03:24:04Z-
dc.date.available2025-09-19T03:24:04Z-
dc.identifier.urihttp://hdl.handle.net/10397/115318-
dc.language.isoenen_US
dc.publisherMolecular Diversity Preservation International (MDPI)en_US
dc.rights© 2025 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/ licenses/by/4.0/).en_US
dc.rightsThe following publication Zhang, M., Qiu, C., Wang, J., Huang, X., Zhang, W., Chin, L.-K., & Shang, W. (2025). A Soft Capacitive Pressure Sensor Based on a Liquid Dielectric Layer. Sensors, 25(9), 2700 is available at https://doi.org/10.3390/s25092700.en_US
dc.subjectAdjustable sensitivityen_US
dc.subjectCapacitive pressure sensoren_US
dc.subjectSoft electronicsen_US
dc.subjectDimeticoneen_US
dc.subjectAdjustable sensitivityen_US
dc.subjectApplication prospecten_US
dc.subjectBroad applicationen_US
dc.subjectCapacitive pressure sensorsen_US
dc.subjectDielectric layeren_US
dc.subjectElectronic technologiesen_US
dc.subjectLiquid dielectricsen_US
dc.subjectLiquid solutionen_US
dc.subjectSoft electronicsen_US
dc.subjectWearable devicesen_US
dc.subjectElectronic medical equipmenten_US
dc.subjectDimeticoneen_US
dc.subjectArticleen_US
dc.subjectBiocompatibilityen_US
dc.subjectControlled studyen_US
dc.subjectElectronicsen_US
dc.subjectLaser surgeryen_US
dc.subjectLiquiden_US
dc.subjectNonhumanen_US
dc.subjectPoint of care systemen_US
dc.subjectPressureen_US
dc.subjectSensoren_US
dc.subjectWearable deviceen_US
dc.titleA soft capacitive pressure sensor based on a liquid dielectric layeren_US
dc.typeJournal/Magazine Articleen_US
dc.identifier.volume25-
dc.identifier.issue9-
dc.identifier.doi10.3390/s25092700-
dcterms.abstractSoft electronic technology has broad application prospects in biomedical and wearable devices, among others, due to its flexibility, lightweight nature, and biocompatibility. Although various materials and structures have been proposed for pressure sensors based on soft electronic technology, most studies focus on a specific function with fixed sensitivity, lacking tunability to expand the operational range. In this work, we demonstrated a low-cost polydimethylsiloxane (PDMS)-based pressure sensor that can be easily fabricated by laser ablation and mature PDMS fabrication technology. We then employed a liquid solution to serve as the dielectric layer of the pressure sensor. By injecting different liquid solutions, the sensitivity of the capacitive pressure sensor can be easily adjusted. A 2.73-fold increase in sensitivity and excellent sensing linearity with a determination coefficient greater than 0.85 were achieved. The pressure sensor was applied to demonstrate material property measurements and Morse code adaptation. We foresee that the adjustable soft capacitive pressure sensor has extensive applications in wearable devices, material metrology, healthcare point-of-care devices, and other fields.-
dcterms.accessRightsopen accessen_US
dcterms.bibliographicCitationSensors, 2025, v. 25, no. 9, 2700-
dcterms.isPartOfSensors-
dcterms.issued2025-
dc.identifier.scopus2-s2.0-105004933575-
dc.identifier.pmid40363139-
dc.identifier.eissn1424-8220-
dc.identifier.artn2700-
dc.description.validate202509 bchy-
dc.description.oaVersion of Recorden_US
dc.identifier.FolderNumberCDCF_2024-2025en_US
dc.description.fundingSourceRGCen_US
dc.description.fundingSourceOthersen_US
dc.description.fundingTextThis research was funded by the National Natural Science Foundation of China (grant no. 62205074), Guangdong Basic and Applied Basic Research Foundation (grant no. 2022A1515011354, grant no. 2023A1515011345), Guangzhou Municipal Science and Technology Project (grant no. SL2023A03J01033), and Hong Kong RGC (grant no. 21203724).en_US
dc.description.pubStatusPublisheden_US
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