Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/115303
DC FieldValueLanguage
dc.contributorDepartment of Mechanical Engineering-
dc.creatorGu, H-
dc.creatorLi, M-
dc.creatorZhang, J-
dc.creatorWang, Z-
dc.date.accessioned2025-09-19T03:23:58Z-
dc.date.available2025-09-19T03:23:58Z-
dc.identifier.urihttp://hdl.handle.net/10397/115303-
dc.language.isoenen_US
dc.publisherJapan Society of Mechanical Engineers,Nihon Kikai Gakkaien_US
dc.rights© 2025 The Japan Society of Mechanical Engineers. This is an open access article under the terms of the Creative Commons Attribution-NonCommercialNoDerivs license (https://creativecommons.org/licenses/by-nc-nd/4.0/).en_US
dc.rightsThe following publication Gu, H., Li, M., Zhang, J., & Wang, Z. (2025). Recent advances in strategies for inhibiting Leidenfrost effect. Journal of Thermal Science and Technology, 20(1), 24-00360 is available at https://doi.org/10.1299/jtst.24-00360.en_US
dc.subjectExternal fieldsen_US
dc.subjectExtreme thermal managementen_US
dc.subjectInhibition strategiesen_US
dc.subjectLeidenfrost effecten_US
dc.subjectLiquid modificationen_US
dc.subjectSurface engineeringen_US
dc.subjectBehavioral researchen_US
dc.subjectHigh temperature applicationsen_US
dc.subjectHigh temperature effectsen_US
dc.subjectHigh temperature engineeringen_US
dc.subjectCooling solutionsen_US
dc.subjectExternal fieldsen_US
dc.subjectExtreme thermal managementen_US
dc.subjectIndustrialisationen_US
dc.subjectInhibition strategyen_US
dc.subjectLeidenfrost effecten_US
dc.subjectLiquid modificationen_US
dc.subjectSurface engineeringen_US
dc.subjectThermalen_US
dc.subjectThermal coolingen_US
dc.subjectThermal comforten_US
dc.titleRecent advances in strategies for inhibiting Leidenfrost effecten_US
dc.typeJournal/Magazine Articleen_US
dc.identifier.volume20-
dc.identifier.issue1-
dc.identifier.doi10.1299/jtst.24-00360-
dcterms.abstractThe rapid progression of industrialization and the integration of artificial intelligence in recent years emphasizes the critical need for efficient thermal cooling solutions. Despite significant strides in technology, existing liquid cooling methods, notably boiling heat transfer and spray cooling, encounter substantial obstacles attributable to the well-documented Leidenfrost effect. Upon contact with a highly heated surface, a liquid generates a vapor layer that acts as an insulator, elevating the liquid above the surface and severely impeding heat transfer efficiency. While notable advancements have been achieved in mitigating the Leidenfrost effect, a comprehensive understanding of the underlying mechanisms remains limited. Furthermore, challenges persist in sustaining high-temperature environments across diverse structures, materials, and technologies, impeding progress in this domain. This review aims to provide a thorough account of fundamental tactics for suppressing the Leidenfrost phenomenon on high-temperature substrates. It will underscore distinctive attributes and challenges while exploring avenues for the development of efficient and sustainable thermal management solutions.-
dcterms.accessRightsopen accessen_US
dcterms.bibliographicCitationJournal of thermal science and technology, 2025, v. 20, no. 1, 24-00360-
dcterms.isPartOfJournal of thermal science and technology-
dcterms.issued2025-
dc.identifier.scopus2-s2.0-105002461124-
dc.identifier.eissn1880-5566-
dc.identifier.artn24-00360-
dc.description.validate202509 bchy-
dc.description.oaVersion of Recorden_US
dc.identifier.FolderNumberCDCF_2024-2025en_US
dc.description.fundingSourceRGCen_US
dc.description.fundingSourceOthersen_US
dc.description.fundingTextWe acknowledge financial support from the of National Natural Science Foundation China (Nos. T2293694, 52333015, 11215523), National Key Research and Development Program of China (No. 2023YFE0209900), Research Grants Council of Hong Kong (Nos. 15237824, SRFS2223-1S01, 11215523, N_PolyU5172/24), the Innovation and Technology Commission of Hong Kong (No. MHP/025/23), Meituan Foundation through the Green Tech Award, and Research, Academic and Industry Sectors One-plus Scheme (No. RAI/23/1/094A). All authors declare no competing financial or personal interests. Huaduo Gu and Mingyu Li contribute equally to this work.en_US
dc.description.pubStatusPublisheden_US
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