Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/114155
DC FieldValueLanguage
dc.contributorDepartment of Mechanical Engineering-
dc.creatorWang, Jen_US
dc.creatorYang, Hen_US
dc.creatorFu, MWen_US
dc.date.accessioned2025-07-15T08:41:56Z-
dc.date.available2025-07-15T08:41:56Z-
dc.identifier.issn2214-8604en_US
dc.identifier.urihttp://hdl.handle.net/10397/114155-
dc.language.isoenen_US
dc.publisherElsevier BVen_US
dc.subjectAdditive manufacturingen_US
dc.subjectAl-12Sien_US
dc.subjectElemental segregationen_US
dc.subjectEutecticsen_US
dc.subjectHeat resistanceen_US
dc.titleAn additively manufactured heat-resistant Al-12Si alloy via introducing stable eutectic engineeringen_US
dc.typeJournal/Magazine Articleen_US
dc.identifier.volume95en_US
dc.identifier.doi10.1016/j.addma.2024.104523en_US
dcterms.abstractThe poor microstructural stability of crack-free Al alloys synthesized via additive manufacturing typically possesses poor heat resistance. In this work, a novel heat-resistant Al-12Si-1.5Ni-2.0Fe (wt%) alloy was fabricated by additive manufacturing, in which tensile strength reaches 271 MPa and 98.1 MPa at 300 ºC and 400 ºC, respectively. Calculation and electron microscopy characterizations show that Fe/Ni segregation with high partition coefficients and low diffusion rates delivers a high thermally stability, thus providing a robust pinning force to inhibit the broken-up of Si eutectics and a solid barrier for dislocation motion at elevated temperatures. In addition to providing weight reduction by substituting Steel, Ti, and Ni-based alloys at 200–450 °C, the adoption of low-cost and stable eutectic engineering reduces the economic barriers to additive manufacturing applications.-
dcterms.accessRightsembargoed accessen_US
dcterms.bibliographicCitationAdditive manufacturing, 5 Sept 2024, v. 95, 104523en_US
dcterms.isPartOfAdditive manufacturingen_US
dcterms.issued2024-09-05-
dc.identifier.scopus2-s2.0-85208129381-
dc.identifier.eissn2214-7810en_US
dc.identifier.artn104523en_US
dc.description.validate202507 bcch-
dc.identifier.FolderNumbera3852b-
dc.identifier.SubFormID51364-
dc.description.fundingSourceRGCen_US
dc.description.fundingSourceOthersen_US
dc.description.fundingTextHong Kong Polytechnic Universityen_US
dc.description.fundingTextWolfson Visiting Fellowshipen_US
dc.description.pubStatusPublisheden_US
dc.date.embargo2026-09-05en_US
dc.description.oaCategoryGreen (AAM)en_US
Appears in Collections:Journal/Magazine Article
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Embargo End Date 2026-09-05
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