Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/113638
DC FieldValueLanguage
dc.contributorDepartment of Industrial and Systems Engineering-
dc.creatorZou, Z-
dc.creatorChan, KC-
dc.creatorWang, Y-
dc.creatorHuang, T-
dc.creatorYue, T-
dc.creatorGuo, Z-
dc.creatorLiu, J-
dc.date.accessioned2025-06-16T08:25:05Z-
dc.date.available2025-06-16T08:25:05Z-
dc.identifier.issn0924-0136-
dc.identifier.urihttp://hdl.handle.net/10397/113638-
dc.language.isoenen_US
dc.publisherElsevier BVen_US
dc.subjectEC-SDMen_US
dc.subjectECDMen_US
dc.subjectIntegrated tool electrodeen_US
dc.subjectMacro-sized holesen_US
dc.subjectStray electrochemical dischargeen_US
dc.titleA new technique for electrochemical self-discharge machining of macro-sized hole in the glass using an integrated tool electrodeen_US
dc.typeJournal/Magazine Articleen_US
dc.identifier.volume333-
dc.identifier.doi10.1016/j.jmatprotec.2024.118607-
dcterms.abstractOwing to stray electrochemical discharge effects, it is still a significant challenge to obtain high machining quality and efficiency in conventional electrochemical discharge machining (ECDM) of macro-sized holes (>1 mm) in glass. Thus, in this study, an electrochemical self-discharge machining (EC-SDM) technique using an integrated tool electrode is proposed. In the new design, the tool anode and cathode are configured coaxially in an integral manner. The simulation and high-speed camera observation results indicated that the electrochemical discharges were more concentrated at the tool electrode end when using the EC-SDM. Thus, the stray electrochemical discharge capacity decreased significantly. With the formation of a dense oxidized layer on the anode electrode surface, the EC-SDM technique is frequently interrupted by DC pulse; however, the discharge is continuous under bipolar pulse conditions. Furthermore, the EC-SDM technique can utilize the advantage of the hydrogen-oxygen gas mixture generated at the integrated electrode end for combustion close to the workpiece surface, thus increasing machining efficiency. When compared with the conventional ECDM, the machining efficiency increased by 6.09 times, and the entrance heat affected zone (HAZ) reduced by 54.05 %. A macro-sized hole (entrance diameter of 1303 μm) with depth of 1520 μm, minimal thermal and mechanical damage was successfully obtained in the glass substrate by using the EC-SDM technique. The results illustrate that employing the novel EC-SDM technique is a straightforward way to reduce stray electrochemical discharge and improve the machining performance of macro-sized glass holes. The potential of the EC-SDM technique for MEMS applications was also highlighted.-
dcterms.accessRightsembargoed accessen_US
dcterms.bibliographicCitationJournal of materials processing technology, Dec. 2024, v. 333, 118607-
dcterms.isPartOfJournal of materials processing technology-
dcterms.issued2024-12-
dc.identifier.eissn1873-4774-
dc.identifier.artn118607-
dc.description.validate202506 bcch-
dc.identifier.FolderNumbera3704en_US
dc.identifier.SubFormID50783en_US
dc.description.fundingSourceOthersen_US
dc.description.fundingTextThe National Natural Science Foundation of China (Grant Nos. 52075104 and 52175387); the Innovation and Technology Commission (ITC) of the Government of the Hong Kong Special Administrative Region (HKSAE), China; the Research Committee (Project code: BBR6 and BBX2) of The Hong Kong Polytechnic Universityen_US
dc.description.pubStatusPublisheden_US
dc.date.embargo2026-12-31en_US
dc.description.oaCategoryGreen (AAM)en_US
Appears in Collections:Journal/Magazine Article
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Embargo End Date 2026-12-31
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