Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/113349
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dc.contributorDepartment of Electrical and Electronic Engineering-
dc.creatorWei, HL-
dc.creatorHuang, H-
dc.creatorWoo, CH-
dc.creatorZhang, XX-
dc.creatorZhou, LG-
dc.date.accessioned2025-06-02T06:58:37Z-
dc.date.available2025-06-02T06:58:37Z-
dc.identifier.issn0003-6951-
dc.identifier.urihttp://hdl.handle.net/10397/113349-
dc.language.isoenen_US
dc.publisherAIP Publishing LLCen_US
dc.rights© 2004 American Institute of Physics.en_US
dc.rightsThis article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing. This article appeared in H. L. Wei, Hanchen Huang, C. H. Woo, X. X. Zhang, L. G. Zhou; Chemistry-mediated two-dimensional to three-dimensional transition of In thin films. Appl. Phys. Lett. 28 June 2004; 84 (26): 5401–5403 and may be found at https://doi.org/10.1063/1.1767595.en_US
dc.titleChemistry-mediated two-dimensional to three-dimensional transition of In thin filmsen_US
dc.typeJournal/Magazine Articleen_US
dc.identifier.spage5401-
dc.identifier.epage5403-
dc.identifier.volume84-
dc.identifier.issue26-
dc.identifier.doi10.1063/1.1767595-
dcterms.abstractThe mechanism of chemistry-mediated two-dimensional to three-dimensional (2D-3D) transition during In thin film deposition was investigated. In was deposited on Au substrateusing magnetron sputtering technique. The formation of Au 3In on Au substrate resulted in the 2d-3D transition. It was observed that alloy formation leads to nonwetting of In, high mobility of In atoms and In clusters and well-separated In islands. The results show that structures of In and Au3 are characterized by scanning electron microscopy, transmission electron microscopy and electron diffraction.-
dcterms.accessRightsopen accessen_US
dcterms.bibliographicCitationApplied physics letters, 28 June 2004, v. 84, no. 26, p. 5401-5403-
dcterms.isPartOfApplied physics letters-
dcterms.issued2004-06-28-
dc.identifier.scopus2-s2.0-3242732334-
dc.identifier.eissn1077-3118-
dc.description.validate202506 bcch-
dc.description.oaVersion of Recorden_US
dc.identifier.FolderNumberOA_Othersen_US
dc.description.fundingSourceRGCen_US
dc.description.fundingSourceOthersen_US
dc.description.fundingTextThe Focus Center—New York, Rensselaer: Interconnections for Gigascale Integrationen_US
dc.description.pubStatusPublisheden_US
dc.description.oaCategoryVoR alloweden_US
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