Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/110932
| Title: | Wideband vibration suppression device utilizing properties of sonic black hole | Authors: | Cheng, L Zhou, T |
Issue Date: | 2-Apr-2024 | Source: | US Patent US 11,946,523 B2. Washington, DC: US Patent and Trademark Office, 2024. | Abstract: | A wideband vibration suppression device utilizing properties of a sonic black hole, comprising: a vibration absorber (101) comprising a uniform portion (1011) of a fixed thickness and a conical portion (1012) integrally connected to the uniform portion (1011), the conical portion (1012) extending from the junction in such a manner that the thickness thereof gradually decreases from the thickness (d1) of the uniform portion (1011) to a predetermined thickness (d2); and a damping layer (102) attached to the conical portion (1012) of the vibration absorber (101). | Rights: | Assignee: The Hong Kong Polytechnic University |
| Appears in Collections: | Patent |
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| File | Description | Size | Format | |
|---|---|---|---|---|
| US-11946523-B2_I.pdf | 989.42 kB | Adobe PDF | View/Open |
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