Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/110932
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dc.contributorDepartment of Mechanical Engineering-
dc.creatorCheng, L-
dc.creatorZhou, T-
dc.date.accessioned2025-02-17T01:34:17Z-
dc.date.available2025-02-17T01:34:17Z-
dc.identifier.urihttp://hdl.handle.net/10397/110932-
dc.language.isoenen_US
dc.rightsAssignee: The Hong Kong Polytechnic Universityen_US
dc.titleWideband vibration suppression device utilizing properties of sonic black holeen_US
dc.typePatenten_US
dc.description.otherinformationUS11946523; US11946523 B2; US11946523B2; US11,946,523; US11,946,523 B2; 11946523; Appl. No. 16/965851en_US
dcterms.abstractA wideband vibration suppression device utilizing properties of a sonic black hole, comprising: a vibration absorber (101) comprising a uniform portion (1011) of a fixed thickness and a conical portion (1012) integrally connected to the uniform portion (1011), the conical portion (1012) extending from the junction in such a manner that the thickness thereof gradually decreases from the thickness (d1) of the uniform portion (1011) to a predetermined thickness (d2); and a damping layer (102) attached to the conical portion (1012) of the vibration absorber (101).-
dcterms.accessRightsopen accessen_US
dcterms.bibliographicCitationUS Patent US 11,946,523 B2. Washington, DC: US Patent and Trademark Office, 2024.-
dcterms.issued2024-04-02-
dc.description.countryUS-
dc.description.validate202502 bcch-
dc.description.oaVersion of Recorden_US
dc.description.pubStatusPublisheden_US
dc.description.oaCategoryNAen_US
Appears in Collections:Patent
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