Ultrathin, soft, radiative cooling interfaces for advanced thermal management in skin electronics

Abstract

Thermal management plays a notable role in electronics, especially for the emerging wearable and skin elec-tronics, as the level of integration, multifunction, and miniaturization of such electronics is determined by thermal management. Here, we report a generic thermal management strategy by using an ultrathin, soft, ra-diative-cooling interface (USRI), which allows cooling down the temperature in skin electronics through both radiative and nonradiative heat transfer, achieving temperature reduction greater than 56 degrees C. The light and in-trinsically flexible nature of the USRI enables its use as a conformable sealing layer and hence can be readily integrated with skin electronics. Demonstrations include passive cooling down of Joule heat for flexible circuits, improving working efficiency for epidermal electronics, and stabling performance outputs for skin-interfaced wireless photoplethysmography sensors. These results offer an alternative pathway toward achieving effective thermal management in advanced skin-interfaced electronics for multifunctionally and wirelessly operated health care monitoring.