Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/106014
DC Field | Value | Language |
---|---|---|
dc.contributor | Department of Industrial and Systems Engineering | en_US |
dc.creator | Jelenković, EV | en_US |
dc.creator | To, S | en_US |
dc.creator | Chen, L | en_US |
dc.creator | Xiao, G | en_US |
dc.creator | Zhao, Z | en_US |
dc.creator | Tang, CY | en_US |
dc.date.accessioned | 2024-04-24T06:14:59Z | - |
dc.date.available | 2024-04-24T06:14:59Z | - |
dc.identifier.issn | 0960-1317 | en_US |
dc.identifier.uri | http://hdl.handle.net/10397/106014 | - |
dc.language.iso | en | en_US |
dc.publisher | Institute of Physics Publishing | en_US |
dc.rights | © 2018 IOP Publishing Ltd | en_US |
dc.rights | This is the Accepted Manuscript version of an article accepted for publication in Journal of Micromechanics and Microengineering. IOP Publishing Ltd is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The Version of Record is available online at https://doi.org/10.1088/1361-6439/aac795. | en_US |
dc.rights | This manuscript version is made available under the CC-BY-NC-ND 4.0 license (https://creativecommons.org/licenses/by-nc-nd/4.0/) | en_US |
dc.subject | Ultra-precision machining | en_US |
dc.subject | Brittle-ductile cutting mode transition | en_US |
dc.subject | Amorphous silicon | en_US |
dc.subject | Micro machining | en_US |
dc.title | Cutting properties of deposited amorphous silicon in ultra-precision machining | en_US |
dc.type | Journal/Magazine Article | en_US |
dc.identifier.volume | 28 | en_US |
dc.identifier.issue | 9 | en_US |
dc.identifier.doi | 10.1088/1361-6439/aac795 | en_US |
dcterms.abstract | The widely used amorphous silicon material is often a deposited one. It is mainly applied in the electronic industry and shows to be a promising candidate for optical devices. The mechanical cutting of deposited amorphous silicon has not been reported so far, while ultra-precision machining of such material for optical devices can be superior to a lithographic approach. In this article, for the first time, cutting properties of deposited amorphous silicon are compared with those of single crystal silicon and polycrystalline silicon, using plunge cut experiment. It is found that the critical depth of cut (CDC) and cutting forces for the amorphous silicon are close to those of single crystalline silicon in the easy-to-cut orientation. In comparison to the polycrystalline silicon, amorphous silicon has higher CDC and lower cutting force. This may allow machining of amorphous optical devices on different semiconductors and/or moulds on various materials with enhanced and isotropic CDC, reduced tool wear and simplified cutting control. | en_US |
dcterms.accessRights | open access | en_US |
dcterms.bibliographicCitation | Journal of micromechanics and microengineering, Sept. 2018, v. 28, no. 9, 095013 | en_US |
dcterms.isPartOf | Journal of micromechanics and microengineering | en_US |
dcterms.issued | 2018-09 | - |
dc.identifier.artn | 095013 | en_US |
dc.description.validate | 202404 bcwh | en_US |
dc.description.oa | Accepted Manuscript | en_US |
dc.identifier.FolderNumber | ISE-0639 | - |
dc.identifier.SubFormID | 60224445 | - |
dc.description.fundingSource | Others | en_US |
dc.description.fundingText | The Hong Kong Polytechnic University | en_US |
dc.description.pubStatus | Published | en_US |
dc.description.oaCategory | Green (AAM) | en_US |
Appears in Collections: | Journal/Magazine Article |
Files in This Item:
File | Description | Size | Format | |
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Jelenkovic_Cutting_Properties_Deposited.pdf | Pre-Published version | 458.8 kB | Adobe PDF | View/Open |
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