Application of X- ray diffraction to study the grinding induced surface damage mechanism of WC/Co

Abstract

X-ray diffraction was utilized to examine the WC/Co surface after high spindle speed grinding (HSSG) to get a further insight into the machining induced surface damage mechanism. The results showed that grinding induced reorientation and preferred {100}/{10 −10} growth of WC particles occurred in the deformed surface, while the crystallinity of WC(001) increased. Based on the analysis of the penetration depth of X ray in WC and Co, grazing incidence X-ray diffraction (GIXRD) showed that the grinding induced preferred crystal growth occurred only in the outmost layer (~ 3.324 nm), but the compressive stress was caused to a certain depth of the subsurface (> 756.18 nm).