Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/102765
PIRA download icon_1.1View/Download Full Text
Title: Characterization of motion artifacts from the interfacial instability of textile electrodes and skin using a simulated method
Authors: Xu, PJ
Wang, FM
Liu, H
Tao, XM 
Issue Date: 2016
Source: 9th Textile Bioengineering and Informatics Symposium Proceedings (TBIS 2016), 2016, p. 887-894
Abstract: An objective method to evaluate the motion artifacts of textile electrodes was presented using a self-made apparatus. The apparatus simulates skin-electrode mechanical interaction by controlling electrodes moving on a volume conductor with various speed and contact pressure. Three different types of electrodes was characterized and the motion induced electrical noise (Eocp) of a pair of the same structural electrodes were recorded, peak-to-peak of the noise (Eocp ) was calculated for evaluating the amplitude of motion artifacts. The results shown that motion artifacts decreased with increased movement speed and contact pressure. For textile electrodes, woven plain structure exhibits the minimum motion artifacts.
Keywords: Electrocardiogram (ECG)
Textile electrodes
Motion artifacts
Interfacial instability
Open circuit potential (OCP)
Publisher: Curran Associates, Inc.
ISBN: 978-1-5108-2898-8 (Print)
Description: 9th Textile Bioengineering and Informatics Symposium (TBIS 2016), Melbourne, Australia, 12-15 July 2016
Rights: Copyright© (2016) by Textile Bioengineering and Informatics Society (TBIS). All rights reserved.
Posted with permission of the publisher.  
Appears in Collections:Conference Paper

Files in This Item:
File Description SizeFormat 
Wang_Characterization_Motion_Artifacts.pdfPre-Published version1.36 MBAdobe PDFView/Open
Open Access Information
Status open access
File Version Final Accepted Manuscript
Access
View full-text via PolyU eLinks SFX Query
Show full item record

Page views

96
Citations as of Apr 14, 2025

Downloads

60
Citations as of Apr 14, 2025

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.