Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/102730
PIRA download icon_1.1View/Download Full Text
DC FieldValueLanguage
dc.contributorInstitute of Textiles and Clothingen_US
dc.creatorCheung, TWen_US
dc.creatorLiu, Ten_US
dc.creatorYao, MYen_US
dc.creatorTao, Yen_US
dc.creatorHe, Len_US
dc.creatorLi, Len_US
dc.date.accessioned2023-11-14T01:15:15Z-
dc.date.available2023-11-14T01:15:15Z-
dc.identifier.issn0040-5175en_US
dc.identifier.urihttp://hdl.handle.net/10397/102730-
dc.language.isoenen_US
dc.publisherSAGE Publicationsen_US
dc.rightsThis is the accepted version of the publication Cheung, T. W., Liu, T., Yao, M. Y., Tao, Y., Lin, H., & Li, L. (2022). Structural development of a flexible textile-based thermocouple temperature sensor. Textile Research Journal (vol 92, no. 9-10) pp. 1682-1693. Copyright © The Author(s) 2021. DOI: 10.1177/00405175211057132en_US
dc.subjectConductive yarnsen_US
dc.subjectElectronic intelligenceen_US
dc.subjectFlexibleen_US
dc.subjectSmart textilesen_US
dc.subjectTemperature sensoren_US
dc.subjectThermocoupleen_US
dc.titleStructural development of a flexible textile-based thermocouple temperature sensoren_US
dc.typeJournal/Magazine Articleen_US
dc.identifier.spage1682en_US
dc.identifier.epage1693en_US
dc.identifier.volume92en_US
dc.identifier.issue9-10en_US
dc.identifier.doi10.1177/00405175211057132en_US
dcterms.abstractTextiles are conventionally utilized as the raw materials for making clothing and complementary accessories. To keep abreast of the times, a new direction of integrating textiles into electronic technology has been given in order to develop a temperature-sensing device with outstanding built-in flexibility, versality and softness. In this study, a flexible construction of the textile-based thermocouple temperature sensor via an industrial-and-technological-based weaving process was designed. The feasible arrangement of the conductive textile materials in the warp and weft directions related to the temperature-sensing ability was studied in detail, and significant linearity was shown in the range of 5–50 (Formula presented.) with different groups of combinations of the conductive yarns. More cross-intersections and ‘hot junctions’ resulted from the 3 × 3 warp–weft arrangement, offering higher stability and accuracy in thermal sensation. Besides, the resistance of the thermocouple remained almost constant under different degrees of bending. The relationship between the resistance and the bending flexibility was also investigated over a range of temperature.en_US
dcterms.accessRightsopen accessen_US
dcterms.bibliographicCitationTextile research journal, May 2022, v. 92, no. 9-10, p. 1682-1693en_US
dcterms.isPartOfTextile research journalen_US
dcterms.issued2022-05-
dc.identifier.scopus2-s2.0-85120553013-
dc.identifier.eissn1746-7748en_US
dc.description.validate202208 bcfcen_US
dc.description.oaAccepted Manuscripten_US
dc.identifier.FolderNumberITC-0143-
dc.description.fundingSourceOthersen_US
dc.description.fundingTextGRFen_US
dc.description.pubStatusPublisheden_US
dc.identifier.OPUS52214498-
dc.description.oaCategoryGreen (AAM)en_US
Appears in Collections:Journal/Magazine Article
Files in This Item:
File Description SizeFormat 
Cheung_Structural_Development_Flexible.pdfPre-Published version951.43 kBAdobe PDFView/Open
Open Access Information
Status open access
File Version Final Accepted Manuscript
Access
View full-text via PolyU eLinks SFX Query
Show simple item record

Page views

86
Citations as of Apr 14, 2025

Downloads

125
Citations as of Apr 14, 2025

SCOPUSTM   
Citations

13
Citations as of Dec 19, 2025

WEB OF SCIENCETM
Citations

6
Citations as of Aug 22, 2024

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.