Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/102633
PIRA download icon_1.1View/Download Full Text
DC FieldValueLanguage
dc.contributorDepartment of Civil and Environmental Engineering-
dc.creatorZhang, YYen_US
dc.creatorPei, QXen_US
dc.creatorMai, YWen_US
dc.creatorLai, SKen_US
dc.date.accessioned2023-10-26T07:20:01Z-
dc.date.available2023-10-26T07:20:01Z-
dc.identifier.issn0022-3727en_US
dc.identifier.urihttp://hdl.handle.net/10397/102633-
dc.language.isoenen_US
dc.publisherInstitute of Physics Publishingen_US
dc.rights© 2016 IOP Publishing Ltden_US
dc.rightsThis is the Accepted Manuscript version of an article accepted for publication in Journal of Physics D: Applied Physics. IOP Publishing Ltd is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The Version of Record is available online at https://doi.org/10.1088/0022-3727/49/46/465301.en_US
dc.rightsThis manuscript version is made available under the CC-BY-NC-ND 4.0 license (https://creativecommons.org/licenses/by-nc-nd/4.0/)en_US
dc.subjectInterfacial thermal conductanceen_US
dc.subjectGraphene/phosphorene heterostructuresen_US
dc.subjectMolecular dynamics simulationsen_US
dc.subjectDefectsen_US
dc.subjectStrainen_US
dc.titleInterfacial thermal conductance in multilayer graphene/phosphorene heterostructureen_US
dc.typeJournal/Magazine Articleen_US
dc.identifier.volume49en_US
dc.identifier.issue46en_US
dc.identifier.doi10.1088/0022-3727/49/46/465301en_US
dcterms.abstractVertical integration of 2D materials has recently appeared as an effective method for the design of novel nano-scale devices. Using non-equilibrium molecular dynamics simulations, we study the interfacial thermal transport property of graphene/phosphorene heterostructures where phosphorene is sandwiched in between graphene. Various modulation techniques are thoroughly explored. We found that the interfacial thermal conductance at the interface of graphene and phosphorene can be enhanced significantly by using vacancy defects, hydrogenation and cross-plane compressive strain. By contrast, the reduction in the interfacial thermal conductance can be achieved by using cross-plane tensile strain. Our results provide important guidelines for manipulating the thermal transport in graphene/phosphorene based-nano-devices.-
dcterms.accessRightsopen accessen_US
dcterms.bibliographicCitationJournal of physics. D, Applied physics, 23 Nov. 2016, v. 49, no. 46, 465301en_US
dcterms.isPartOfJournal of physics. D, Applied physicsen_US
dcterms.issued2016-11-23-
dc.identifier.scopus2-s2.0-84997708044-
dc.identifier.eissn1361-6463en_US
dc.identifier.artn465301en_US
dc.description.validate202310 bcch-
dc.description.oaAccepted Manuscripten_US
dc.identifier.FolderNumberCEE-2438-
dc.description.fundingSourceOthersen_US
dc.description.fundingTextHong Kong Polytechnic Universityen_US
dc.description.pubStatusPublisheden_US
dc.identifier.OPUS6699622-
dc.description.oaCategoryGreen (AAM)en_US
Appears in Collections:Journal/Magazine Article
Files in This Item:
File Description SizeFormat 
Lai_Interfacial_Thermal_Conductance.pdfPre-Published version1.21 MBAdobe PDFView/Open
Open Access Information
Status open access
File Version Final Accepted Manuscript
Access
View full-text via PolyU eLinks SFX Query
Show simple item record

Page views

134
Last Week
6
Last month
Citations as of Nov 9, 2025

Downloads

121
Citations as of Nov 9, 2025

SCOPUSTM   
Citations

28
Citations as of Dec 19, 2025

WEB OF SCIENCETM
Citations

14
Citations as of Dec 18, 2025

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.