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Title: Multifactors affecting residential well-being in urban communities of Shenzhen incorporating intelligent technologies
Authors: Wei, X 
Zou, G
Siu, KWM 
Issue Date: 2022
Source: Mobile Information Systems, 2022, v. 2022, 3179358
Abstract: Rapid urban development is inseparable from technological advances, and the application of artificial intelligence in community life is becoming widespread, affecting residents' lifestyles and psychological well-being. This study investigated a variety of factors that affect the well-being of urban community residents. Environmental and emotional perceptions and overall well-being were assessed based on the responses of 179 respondents from six small communities in Shenzhen, China. Property management was strongly correlated with satisfaction with the physical environment and least correlated with neighborhood form. Pleasure, comfort, and the sense of belonging were correlated. In addition, interviews and questionnaires revealed a strong influence of AI facilities on people's well-being. Factor analysis revealed two-component matrices that explained more than 60% of the factors, which were described as "external"and "internal"factors. Finally, the study analyzes the relationship between intelligent devices and impact factors and their effects on residential well-being.
Publisher: Hindawi Publishing Corporation
Journal: Mobile information systems 
ISSN: 1574-017X
EISSN: 1875-905X
DOI: 10.1155/2022/3179358
Rights: Copyright © 2022 Xintong Wei et al. This is an open access article distributed under the Creative Commons Attribution License (https://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
The following publication Wei, X., Zou, G., & Siu, K. W. M. (2022). Multifactors Affecting Residential Well-Being in Urban Communities of Shenzhen Incorporating Intelligent Technologies. Mobile Information Systems, 2022, Article ID 3179358, is available at https://doi.org/10.1155/2022/3179358.
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