Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/100372
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Title: Effect of post-annealing on sputtered MoS2 films
Authors: Wong, WC 
Ng, SM 
Wong, HF 
Cheng, WF 
Mak, CL 
Leung, CW 
Issue Date: Dec-2017
Source: Solid-state electronics, Dec. 2017, v. 138, p. 62-65
Abstract: Typical routes for fabricating MoS2-based electronic devices rely on the transfer of as-prepared flakes to target substrates, which is incompatible with conventional device fabrication methods. In this work we investigated the preparation of MoS2 films by magnetron sputtering. By subjecting room-temperature sputtered MoS2 films to post-annealing at mild conditions (450 °C in a nitrogen flow), crystalline MoS2 films were formed. To demonstrate the compatibility of the technique with typical device fabrication processes, MoS2 was prepared on epitaxial magnetic oxide films of La0.7Sr0.3MnO3, and the magnetic behavior of the films were unaffected by the post-annealing process. This work demonstrates the possibility of fabricating electronic and spintronic devices based on continuous MoS2 films prepared by sputtering deposition.
Keywords: MoS2
Post-annealing
Transfer-free
Publisher: Pergamon Press
Journal: Solid-state electronics 
ISSN: 0038-1101
DOI: 10.1016/j.sse.2017.07.009
Rights: © 2017 Elsevier Ltd. All rights reserved.
© 2017. This manuscript version is made available under the CC-BY-NC-ND 4.0 license https://creativecommons.org/licenses/by-nc-nd/4.0/.
The following publication Wong, W. C., Ng, S. M., Wong, H. F., Cheng, W. F., Mak, C. L., & Leung, C. W. (2017). Effect of post-annealing on sputtered MoS2 films. Solid-State Electronics, 138, 62-65 is available at https://doi.org/10.1016/j.sse.2017.07.009.
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