Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/82
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Title: Cobalt-molybdenum-phosphorus alloy diffusion barrier coatings
Authors: Man, HC 
Ng, WY
Yeung, CH
Lee, CY
Siu, CL
Tsui, RYC
Yeung, KLK
Issue Date: 4-Mar-2003
Source: US Patent 6,528,184 B2. Washington, DC: US Patent and Trademark Office, 2003.
Abstract: Techniques are provided for electrolessly depositing and electrodepositing a CoMoP barrier coating onto copper or copper alloys to prevent copper diffusion when forming gold layers on articles such as watch bracelets, watch cases, imitation jewellery, spectacle frames, and metal buttons.
Keywords: Cobalt-molybdenum-phosphorus alloy
Barrier coatings
Rights: Assignee: The Hong Kong Polytechnic University.
Assignee: Hong Kong Productivity Council.
Appears in Collections:Patent

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