Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/99280
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Title: Topology optimization of a second-order phononic topological insulator with dual-band corner states
Authors: Chen, Y 
Zhu, J
Su, Z 
Issue Date: 3-Feb-2023
Source: Journal of sound and vibration, 3 Feb. 2023, v. 544, 117410
Abstract: Second-order phononic topological insulators (SPTIs) with topologically protected corner states offer unique routes for the realization of steering elastic waves in lower-dimension regime with robustness. However, prevailing SPTIs only host corner states within a single bandgap, restricting applications of SPTIs in multiband domain. Here, we design four new types of SPTIs with the customized dual-bandgap which supports dual-band corner states. The dual-bandgap is created by simultaneously maximizing the minimum imaginary parts of wave vectors at two desired frequencies via topology optimization. Topological trivial and nontrivial unit cells (UCs), sharing the dual-bandgap, are configured by selecting UCs from the same optimized phononic crystals (PCs) in different ways. The dual-band topological corner states are observed at the corner between the trivial and nontrivial regions. The developed four SPTIs with customized dual-band operating frequencies pave the way for multiband communications and manipulation of elastic waves with enhanced robustness.
Keywords: High-order topological insulators
Phononic crystals
Topology optimization
Publisher: Academic Press
Journal: Journal of sound and vibration 
ISSN: 0022-460X
EISSN: 1095-8568
DOI: 10.1016/j.jsv.2022.117410
Rights: © 2022 Elsevier Ltd. All rights reserved.
© 2022. This manuscript version is made available under the CC-BY-NC-ND 4.0 license https://creativecommons.org/licenses/by-nc-nd/4.0/
The following publication Chen, Y., Zhu, J., & Su, Z. (2023). Topology optimization of a second-order phononic topological insulator with dual-band corner states. Journal of Sound and Vibration, 544, 117410 is available at https://doi.org/10.1016/j.jsv.2022.117410.
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